Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11028478 | Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors | Victor Nguyen, Ning Li, Li-Qun Xia, Mark Saly, David Thompson | 2021-06-08 |
| 11017997 | Methods and apparatus for low temperature silicon nitride films | Wenbo Yan, Cong Trinh, Ning Li, Li-Qun Xia, Maribel Maldonado-Garcia | 2021-05-25 |
| 10957532 | Method and apparatus for deposition of low-k films | Ning Li, Zhelin Sun, Li-Qun Xia, Bhaskar Jyoti Bhuyan, Mark Saly | 2021-03-23 |
| 10923396 | Method of forming self-aligned via | Suketu Arun Parikh | 2021-02-16 |
| 10714331 | Method to fabricate thermally stable low K-FinFET spacer | Srinivas D. Nemani, Mei-Yee Shek, Ellie Yieh | 2020-07-14 |
| 10700072 | Cap layer for bit line resistance reduction | Priyadarshi Panda, Jianxin Lei, Wenting Hou, Ning Li, Sanjay Natarajan +4 more | 2020-06-30 |
| 10629484 | Method of forming self-aligned via | Suketu Arun Parikh | 2020-04-21 |
| 10453678 | Method and apparatus for deposition of low-k films | Ning Li, Zhelin Sun, Li-Qun Xia, Bhaskar Jyoti Bhuyan, Mark Saly | 2019-10-22 |
| 10319583 | Selective deposition of silicon nitride films for spacer applications | Ning Li, Li-Qun Xia | 2019-06-11 |
| 10170298 | High temperature silicon oxide atomic layer deposition technology | Wenbo Yan, Cong Trinh, Ning Li, Victor Nguyen, Li-Qun Xia +1 more | 2019-01-01 |
| 10147599 | Methods for depositing low K and low wet etch rate dielectric thin films | Ning Li, Mark Saly, David Thompson, Li-Qun Xia | 2018-12-04 |
| 10134581 | Methods and apparatus for selective dry etch | Ning Li, Li-Qun Xia, Dongqing Yang, Anchuan Wang | 2018-11-20 |
| 10023958 | Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors | Victor Nguyen, Ning Li, Li-Qun Xia, Mark Saly, David Thompson | 2018-07-17 |
| 9984868 | PEALD of films comprising silicon nitride | Victor Nguyen, Woong Jae Lee, Li-Qun Xia, Derek R. Witty | 2018-05-29 |
| 9875888 | High temperature silicon oxide atomic layer deposition technology | Wenbo Yan, Cong Trinh, Ning Li, Victor Nguyen, Li-Qun Xia +1 more | 2018-01-23 |
| 9799511 | Methods for depositing low k and low wet etch rate dielectric thin films | Ning Li, Mark Saly, David Thompson, Li-Qun Xia | 2017-10-24 |
| 9748093 | Pulsed nitride encapsulation | Patrick Reilly, David Alan Bethke | 2017-08-29 |
| 9633861 | Cu/barrier interface enhancement | Weifeng YE, Mei-Yee Shek, Xiaojun Zhang, Xiaolan Ba, Yu Jin +1 more | 2017-04-25 |
| 9564582 | Method of forming magnetic tunneling junctions | Mahendra Pakala, Jonathan Germain, Jaesoo Ahn, Lin Xue | 2017-02-07 |
| 9297073 | Accurate film thickness control in gap-fill technology | Ning Li, Wenbo Yan, Victor Nguyen, Cong Trinh, Li-Qun Xia | 2016-03-29 |
| 8758638 | Copper oxide removal techniques | Weifeng YE, Victor Nguyen, Mei-Yee Shek, Li-Qun Xia, Derek R. Witty | 2014-06-24 |
| 8753989 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2014-06-17 |
| 8598020 | Plasma-enhanced chemical vapor deposition of crystalline germanium | Victor Nguyen, Li-Qun Xia, Derek R. Witty | 2013-12-03 |
| 8586487 | Low temperature plasma enhanced chemical vapor deposition of conformal silicon carbon nitride and silicon nitride films | Victor Nguyen, Li-Qun Xia, Derek R. Witty | 2013-11-19 |
| 8563090 | Boron film interface engineering | Li-Qun Xia, Derek R. Witty, Yi-Hsing Chen | 2013-10-22 |