Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12405423 | Hybrid edge couplers with voids | Yusheng Bian, Edward W. Kiewra | 2025-09-02 |
| 9330974 | Through level vias and methods of formation thereof | Muhammed Shafi Pallachalil, Moosung Chae, Erdem Kaltalioglu | 2016-05-03 |
| 8865592 | Silicided semiconductor structure and method of forming the same | Jiang Yan, Henning Haffner, Frank Huebinger, Richard Lindsay, Klaus Schruefer | 2014-10-21 |
| 8636879 | Electro chemical deposition systems and methods of manufacturing using the same | Moosung Chae, Bum Ki Moon, Danny Pak-Chum Shum | 2014-01-28 |
| 8618635 | Capacitors in integrated circuits and methods of fabrication thereof | Moosung Chae, Bum Ki Moon | 2013-12-31 |