Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9059170 | Electronic fuse having a damaged region | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li +4 more | 2015-06-16 |
| 9054108 | Random local metal cap layer formation for improved integrated circuit reliability | Ronald G. Filippi, Wai-Kin Li, Ping-Chuan Wang, Lijuan Zhang | 2015-06-09 |
| 8906799 | Random local metal cap layer formation for improved integrated circuit reliability | Ronald G. Filippi, Wai-Kin Li, Ping-Chuan Wang, Lijuan Zhang | 2014-12-09 |
| 8889491 | Method of forming electronic fuse line with modified cap | Ronald G. Filippi, John A. Fitzsimmons, Ping-Chuan Wang, Lijuan Zhang | 2014-11-18 |
| 8890560 | Crack sensors for semiconductor devices | — | 2014-11-18 |
| 8860225 | Devices formed with dual damascene process | Philipp Riess, Hermann Wendt | 2014-10-14 |
| 8822324 | Passivated copper chip pads | Thomas Goebel, Markus Naujok | 2014-09-02 |
| 8748295 | Pads with different width in a scribe line region and method for manufacturing these pads | Matthias Hierlemann | 2014-06-10 |
| 8610238 | Crack stop trenches | Hermann Wendt | 2013-12-17 |
| 8569820 | Capacitor having a plurality of parallel conductive members | Hans-Joachim Barth, Erwin Ruderer, Alexander Von Glasow, Philipp Riess, Peter Baumgartner +2 more | 2013-10-29 |
| 8378439 | Methods of manufacturing semiconductor devices and structures thereof | Michael Beck | 2013-02-19 |
| 8309435 | Crack stops for semiconductor devices | Michael Beck | 2012-11-13 |
| 8159254 | Crack sensors for semiconductor devices | — | 2012-04-17 |
| 8138539 | Semiconductor devices and methods of manufacture thereof | Hans-Joachim Barth, Erwin Ruderer, Alexander Von Glasow, Philipp Riess, Peter Baumgartner +2 more | 2012-03-20 |
| 8093150 | Methods of manufacturing semiconductor devices and structures thereof | Michael Beck | 2012-01-10 |
| 8062971 | Dual damascene process | Philipp Riess, Hermann Wendt | 2011-11-22 |
| 8008750 | Crack stops for semiconductor devices | Michael Beck | 2011-08-30 |
| 7871902 | Crack stop trenches | Hermann Wendt | 2011-01-18 |
| 7858448 | Method of forming support structures for semiconductor devices | Thomas Goebel, Sun-Oo Kim | 2010-12-28 |
| 7843035 | MIM capacitors with catalytic activation layer | Hans-Joachim Barth, Petra Felsner, Gerald Friese | 2010-11-30 |
| 7795615 | Capacitor integrated in a structure surrounding a die | Thomas Goebel, Sun-Oo Kim | 2010-09-14 |
| 7786007 | Method and apparatus of stress relief in semiconductor structures | Mark Hoinkis, Matthias Hierlemann, Gerald Friese, Andy Cowley, Dennis J. Warner | 2010-08-31 |
| 7626268 | Support structures for semiconductor devices | Thomas Goebel, Sun-Oo Kim | 2009-12-01 |
| 7615440 | Capacitor and method of manufacturing a capacitor | Petra Felsner, Thomas Schafbauer, Uwe Kerst, Hans-Joachim Barth | 2009-11-10 |
| 7553703 | Methods of forming an interconnect structure | Klaus Herold | 2009-06-30 |