Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008560 | Capacitors in integrated circuits and methods of fabrication thereof | Moosung Chae, Bum Ki Moon | 2018-06-26 |
| 9437593 | Silicided semiconductor structure and method of forming the same | Jiang Yan, Henning Haffner, Frank Huebinger, Richard Lindsay, Klaus Schruefer | 2016-09-06 |
| 9425140 | Capacitors in integrated circuits and methods of fabrication thereof | Moosung Chae, Bum Ki Moon | 2016-08-23 |
| 9194036 | Plasma vapor deposition | Moosung Chae, Bum Ki Moon | 2015-11-24 |
| 8817451 | Semiconductor devices and methods of manufacture thereof | Yoon-Hae Kim | 2014-08-26 |
| 8748257 | Semiconductor devices and methods of manufacture thereof | — | 2014-06-10 |
| 8298730 | Semiconductor devices and methods of manufacturing thereof | O Seo Park, Klaus Herold | 2012-10-30 |
| 8197660 | Electro chemical deposition systems and methods of manufacturing using the same | Moosung Chae, Bum Ki Moon, Danny Pak-Chum Shum | 2012-06-12 |
| 8004066 | Crack stop and moisture barrier | O Seo Park | 2011-08-23 |
| 7960811 | Semiconductor devices and methods of manufacture thereof | — | 2011-06-14 |
| 7939942 | Semiconductor devices and methods of manufacturing thereof | O Seo Park, Klaus Herold | 2011-05-10 |
| 7879681 | Methods of fabricating three-dimensional capacitor structures having planar metal-insulator-metal and vertical capacitors therein | Yoon-Hae Kim | 2011-02-01 |
| 7858448 | Method of forming support structures for semiconductor devices | Thomas Goebel, Erdem Kaltalioglu | 2010-12-28 |
| 7795615 | Capacitor integrated in a structure surrounding a die | Thomas Goebel, Erdem Kaltalioglu | 2010-09-14 |
| 7741715 | Crack stop and moisture barrier | O Seo Park | 2010-06-22 |
| 7732315 | Methods of fabricating semiconductor devices and structures thereof | Yoon-Hae Kim | 2010-06-08 |
| 7626268 | Support structures for semiconductor devices | Thomas Goebel, Erdem Kaltalioglu | 2009-12-01 |
| 7365025 | Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics | Kyoung-Woo Lee, Seung-Man Choi, Ja-Hum Ku, Ki-Chul Park | 2008-04-29 |
| 7235454 | MIM capacitor structure and method of fabrication | Ernst Demm | 2007-06-26 |
| 7235472 | Method of making fully silicided gate electrode | Veit Klee | 2007-06-26 |
| 7112507 | MIM capacitor structure and method of fabrication | Ernst Demm | 2006-09-26 |
| 7052990 | Sealed pores in low-k material damascene conductive structures | — | 2006-05-30 |
| 7041574 | Composite intermetal dielectric structure including low-k dielectric material | Markus Naujok, Andy Cowley | 2006-05-09 |
| 6087278 | Method for fabricating semiconductor devices having an HDP-CVD oxide layer as a passivation layer | Han-Min Kim | 2000-07-11 |
| 5968156 | Programmable peripheral component interconnect (PCI) bridge for interfacing a PCI bus and a local bus having reconstructable interface logic circuit therein | — | 1999-10-19 |