Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11614163 | Motor control method and device for shift-by-wire system | — | 2023-03-28 |
| 11193582 | Controlling apparatus and method for electric shift-by-wire system | — | 2021-12-07 |
| 10030721 | Method and apparatus for controlling dual clutch transmission | — | 2018-07-24 |
| 9625624 | Color improving film and method of manufacturing the same | Young Oh, Hyun Min Kim, Young Hyun Ju, You-Min Shin, Hong-shik SHIM +2 more | 2017-04-18 |
| 9437524 | Through-silicon via with sidewall air gap | Shan Gao | 2016-09-06 |
| 9349993 | Film for improving color display and method for manufacturing the same, and display apparatus including improved color display film | Young Oh, Hyun Min Kim, You-Min Shin, Hong-shik SHIM, Chul Ho Jeong +1 more | 2016-05-24 |
| 9348066 | Film for improving color display and method of manufacturing the same | Young Oh, Hyun Min Kim, Young Hyun Ju, You-Min Shin, Hong-shik SHIM +2 more | 2016-05-24 |
| 8877559 | Through-silicon via with sidewall air gap | Shan Gao | 2014-11-04 |
| 7911001 | Methods for forming self-aligned dual stress liners for CMOS semiconductor devices | Kyoung-Woo Lee, Ja-Hum Ku, Taehoon Lee, Thomas W. Dyer | 2011-03-22 |
| 7864266 | Diffuser plate, backlight and display having the same | Kyung Joon Lee, Man Suk Kim | 2011-01-04 |
| 7781276 | Methods of forming CMOS integrated circuits that utilize insulating layers with high stress characteristics to improve NMOS and PMOS transistor carrier mobilities | Kyoung-Woo Lee, Ja-Hum Ku | 2010-08-24 |
| 7586175 | Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface | Kyoung-Woo Lee, Ja-Hum Ku, Ki-Chul Park | 2009-09-08 |
| 7514354 | Methods for forming damascene wiring structures having line and plug conductors formed from different materials | Ki-Chul Park, Ja-Hum Ku | 2009-04-07 |
| 7446033 | Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method | Sun Jung Lee, Soo-geun Lee, Hong-Jae Shin, Andrew Tae Kim, Bong Seok Suh | 2008-11-04 |
| 7417302 | Semiconductor device and method of manufacturing the same | Kyoung-Woo Lee, Hong-Jae Shin, Jeong Hoon Ahn, Byung-jun Oh, Yoon-Hae Kim | 2008-08-26 |
| 7387962 | Physical vapor deposition methods for forming hydrogen-stuffed trench liners for copper-based metallization | Kyoung-Woo Lee | 2008-06-17 |
| 7365025 | Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics | Kyoung-Woo Lee, Ja-Hum Ku, Ki-Chul Park, Sun-Oo Kim | 2008-04-29 |
| 7341908 | Semiconductor device and method of manufacturing the same | Bong Seok Suh, Hong-Jae Shin, Young-Jin Wee | 2008-03-11 |
| 7335590 | Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby | Bong Seok Suh, Ki-Chul Park, Il-Ryong Kim | 2008-02-26 |
| 7332764 | Metal-insulator-metal (MIM) capacitor and method of fabricating the same | Ki-Chul Park, Bong Seok Suh, Il-Ryong Kim | 2008-02-19 |
| 7051934 | Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses | Hyo-Jong Lee, Sang-Bum Kang, Gil-Heyun Choi | 2006-05-30 |
| 6884710 | Semiconductor device having multi-layer copper line and method of forming same | Ki-Chul Park | 2005-04-26 |
| 6787460 | Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed | Hyo-Jong Lee, Sang-Bum Kang, Gil-Heyun Choi | 2004-09-07 |
| 6548905 | Semiconductor device having multi-layer copper line and method of forming the same | Ki-Chul Park | 2003-04-15 |