YW

Young-Jin Wee

Samsung: 12 patents #11,258 of 75,807Top 15%
Overall (All Time): #425,233 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7638423 Semiconductor device and method of forming wires of semiconductor device Jung Eun Lee, Andrew Tae Kim, Young-joon Moon 2009-12-29
7635645 Method for forming interconnection line in semiconductor device and interconnection line structure Kyoung-Woo Lee, Hong-Jae Shin, Jae Hak Kim, Seung Jin Lee, Ki-Kwan Park 2009-12-22
7341908 Semiconductor device and method of manufacturing the same Bong Seok Suh, Seung-Man Choi, Hong-Jae Shin 2008-03-11
7192864 Method of forming interconnection lines for semiconductor device Kyoung-Woo Lee, Hong-Jae Shin, Jae Hak Kim, Seung Jin Lee, Ki-Kwan Park 2007-03-20
6842028 Apparatus for testing reliability of interconnection in integrated circuit Won-sang Song, Jung Woo Kim, Chang-Sub Lee, Sam Young Kim, Ki-Chul Park 2005-01-11
6693446 Apparatus for testing reliability of interconnection in integrated circuit Won-sang Song, Jung Woo Kim, Chang-Sub Lee, Sam Young Kim, Ki-Chul Park 2004-02-17
6690187 Apparatus for testing reliability of interconnection in integrated circuit Won-sang Song, Jung Woo Kim, Chang-Sub Lee, Sam Young Kim, Ki-Chul Park 2004-02-10
6483162 Semiconductor device having improved metal line structure and manufacturing method therefor Dong-chul Kwon, Hong-Jae Shin, Sung Jin Kim 2002-11-19
6333260 Semiconductor device having improved metal line structure and manufacturing method therefor Dong-chul Kwon, Hong-Jae Shin, Sung Jin Kim 2001-12-25
6249056 Low resistance interconnect for a semiconductor device and method of fabricating the same Dong-chul Kwon 2001-06-19
6004876 Low resistance interconnect for a semiconductor device and method of fabricating the same Dong-chul Kwon 1999-12-21
5814556 Method of filling a contact hole in a semiconductor substrate with a metal In-seon Park, Sang In Lee 1998-09-29