Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7951712 | Interconnections having double capping layer and method for forming the same | Kyoung-Woo Lee, Ki-Chul Park, Won-sang Song | 2011-05-31 |
| 7605472 | Interconnections having double capping layer and method for forming the same | Kyoung-Woo Lee, Ki-Chul Park, Won-sang Song | 2009-10-20 |
| 7560332 | Integrated circuit capacitor structure | Kyoung-Woo Lee, Wan Jae Park, Jeong Hoon Ahn, Kyung-Tae Lee, Mu-kyeng Jung +2 more | 2009-07-14 |
| 7462507 | Structure of a CMOS image sensor and method for fabricating the same | Ki-Chul Park, Kyoung-Woo Lee | 2008-12-09 |
| 7446033 | Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method | Sun Jung Lee, Hong-Jae Shin, Andrew Tae Kim, Seung-Man Choi, Bong Seok Suh | 2008-11-04 |
| 7399700 | Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating | Kyoung-Woo Lee | 2008-07-15 |
| 7400003 | Structure of a CMOS image sensor and method for fabricating the same | Ki-Chul Park, Kyoung-Woo Lee | 2008-07-15 |
| 7279733 | Dual damascene interconnection with metal-insulator-metal-capacitor and method of fabricating the same | Kyoung-Woo Lee | 2007-10-09 |
| 7229875 | Integrated circuit capacitor structure | Kyoung-Woo Lee, Wan Jae Park, Jeong Hoon Ahn, Kyung-Tae Lee, Mu-kyeng Jung +2 more | 2007-06-12 |
| 7205666 | Interconnections having double capping layer and method for forming the same | Kyoung-Woo Lee, Ki-Chul Park, Won-sang Song | 2007-04-17 |
| 7183195 | Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler | Kyoung-Woo Lee, Wan Jae Park, Jae Hak Kim, Hong-Jae Shin | 2007-02-27 |
| 7041592 | Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene process | Jae Hak Kim, Kyung-Woo Lee | 2006-05-09 |
| 7037835 | Interconnections having double capping layer and method for forming the same | Kyoung-Woo Lee, Ki-Chul Park, Won-sang Song | 2006-05-02 |
| 7022600 | Method of forming dual damascene interconnection using low-k dielectric material | Jae Hak Kim, Ki-Kwan Park, Kyoung-Woo Lee | 2006-04-04 |
| 6953745 | Void-free metal interconnection structure and method of forming the same | Jeong Hoon Ahn, Hyo-Jong Lee, Kyung-Tae Lee, Kyoung-Woo Lee, Bong Seok Suh | 2005-10-11 |
| 6936533 | Method of fabricating semiconductor devices having low dielectric interlayer insulation layer | Jae Hak Kim, Hong-Jae Shin, Kyoung-Woo Lee | 2005-08-30 |
| 6861347 | Method for forming metal wiring layer of semiconductor device | Kyoung-Woo Lee, Hong-Jae Shin, Jae Hak Kim | 2005-03-01 |
| 6861686 | Structure of a CMOS image sensor and method for fabricating the same | Ki-Chul Park, Kyoung-Woo Lee | 2005-03-01 |
| 6855629 | Method for forming a dual damascene wiring pattern in a semiconductor device | Jae Hak Kim, Wan Jae Park, Kyoung-Woo Lee | 2005-02-15 |
| 6849536 | Inter-metal dielectric patterns and method of forming the same | Ju-Hyuk Chung, Il-Goo Kim, Kyoung-Woo Lee, Wan Jae Park, Jae Hak Kim | 2005-02-01 |
| 6828229 | Method of manufacturing interconnection line in semiconductor device | Hong-Jae Shin, Kyoung-Woo Lee, Jae Hak Kim | 2004-12-07 |
| 6815331 | Method for forming metal wiring layer of semiconductor device | Kyoung-Woo Lee, Hong-Jae Shin, Jae Hak Kim | 2004-11-09 |
| 6329276 | Method of forming self-aligned silicide in semiconductor device | Ja-Hum Ku, Chul-Sung Kim, Tae-Wook Seo, Eung-Joon Lee, Joo-Hyuk Chung | 2001-12-11 |
| 5888317 | Hydrogen-storage material employing ti-mn alloy system | Jai-Young Lee, Ki Young Lee, Han Ho Lee, Dong-Myung Kim, Ji Sang Yu +1 more | 1999-03-30 |
| 5857139 | Process for preparing an electrode for secondary battery employing hydrogen-storage alloy | Jai-Young Lee, Ki Young Lee, Han Ho Lee, Dong-Myung Kim, Ji Sang Yu +1 more | 1999-01-05 |