Issued Patents All Time
Showing 26–50 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245824 | Through-vias for wiring layers of semiconductor devices | Christopher V. Jahnes, Bucknell C. Webb | 2016-01-26 |
| 9236325 | Through-vias for wiring layers of semicondutor devices | Christopher V. Jahnes, Bucknell C. Webb | 2016-01-12 |
| 9082781 | Semiconductor article having a zig-zag guard ring and method of forming the same | Ronald G. Filippi, Erdem Kaltalioglu, Thomas M. Shaw, Ping-Chuan Wang, Bucknell C. Webb +1 more | 2015-07-14 |
| 9040841 | Axiocentric scrubbing land grid array contacts and methods for fabrication | Gareth G. Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch | 2015-05-26 |
| 8969174 | Fixed curvature force loading of mechanically spalled films | Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana | 2015-03-03 |
| 8865571 | Dislocation engineering using a scanned laser | Chung Woh Lai, Anita Madan, Klaus W. Schwarz, J. Campbell Scott | 2014-10-21 |
| 8865572 | Dislocation engineering using a scanned laser | Chung Woh Lai, Anita Madan, Klaus W. Schwarz, J. Campbell Scott | 2014-10-21 |
| 8846191 | Thermal expansion control employing platelet fillers | Gareth G. Hougham | 2014-09-30 |
| 8803284 | Thick on-chip high-performance wiring structures | Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee | 2014-08-12 |
| 8796133 | Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections | Griselda Bonilla, Timothy H. Daubenspeck, Mark C. H. Lamorey, Howard S. Landis, David L. Questad +2 more | 2014-08-05 |
| 8765595 | Thick on-chip high-performance wiring structures | Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee | 2014-07-01 |
| 8679943 | Fixed curvature force loading of mechanically spalled films | Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana | 2014-03-25 |
| 8650512 | Elastic modulus mapping of an integrated circuit chip in a chip/device package | Timothy H. Daubenspeck, Mark C. H. Lamorey, Thomas M. Shaw, Thomas A. Wassick | 2014-02-11 |
| 8624152 | Negative coefficient thermal expansion engineered particles for composite fabrication | Gareth G. Hougham, Vijayeshwar D. Khanna, Gerard McVicker | 2014-01-07 |
| 8604618 | Structure and method for reducing vertical crack propagation | Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Thomas L. McDevitt, Gary L. Milo +1 more | 2013-12-10 |
| 8492802 | Multiple orientation nanowires with gate stack sensors | Dureseti Chidambarrao, Lidija Sekaric | 2013-07-23 |
| 8449971 | Thermal expansion control employing platelet fillers | Gareth G. Hougham | 2013-05-28 |
| 8405279 | Coupling piezoelectric material generated stresses to devices formed in integrated circuits | Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martyna, Dennis M. Newns, Kuan-Neng Chen | 2013-03-26 |
| 8367492 | Multiple Orientation Nanowires with Gate Stack Sensors | Dureseti Chidambarrao, Lidija Sekaric | 2013-02-05 |
| 8368125 | Multiple orientation nanowires with gate stack stressors | Dureseti Chidambarrao, Lidija Sekaric | 2013-02-05 |
| 8362596 | Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same | Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Thomas M. Shaw +1 more | 2013-01-29 |
| 8278155 | Reprogrammable fuse structure and method | Geoffrey Burr, Chandrasekharan Kothandaraman, Chung H. Lam, Stephen M. Rossnagel, Christy S. Tyberg +1 more | 2012-10-02 |
| 8263879 | Axiocentric scrubbing land grid array contacts and methods for fabrication | Gareth G. Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch | 2012-09-11 |
| 8247947 | Coupling piezoelectric material generated stresses to devices formed in integrated circuits | Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martyna, Dennis M. Newns, Kuan-Neng Chen | 2012-08-21 |
| 8241957 | Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Christopher V. Jahnes, Paul A. Lauro +2 more | 2012-08-14 |