Issued Patents All Time
Showing 51–75 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8237150 | Nanowire devices for enhancing mobility through stress engineering | Dureseti Chidambarrao, Lidija Sekaric | 2012-08-07 |
| 8159854 | Piezo-effect transistor device and applications | Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martyna, Dennis M. Newns | 2012-04-17 |
| 8138448 | Negative coefficient thermal expansion engineered particles for composite fabrication | Gareth G. Hougham, Vijayeshwar D. Khanna, Gerard McVicker | 2012-03-20 |
| 8138066 | Dislocation engineering using a scanned laser | Chung Woh Lai, Anita Madan, Klaus W. Schwarz, J. Campbell Scott | 2012-03-20 |
| 8119206 | Negative coefficient of thermal expansion particles | Gareth G. Hougham, S. Jay Chey, Joseph Zinter, Michael J. Rooks, Brian Richard Sundolf +1 more | 2012-02-21 |
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Michael Lane, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-12-13 |
| 7989233 | Semiconductor nanowire with built-in stress | Lidija Sekaric, Dureseti Chidambarrao | 2011-08-02 |
| 7960808 | Reprogrammable fuse structure and method | Geoffrey Burr, Chandrasekharan Kothandaraman, Chung H. Lam, Stephen M. Rossnagel, Christy S. Tyberg +1 more | 2011-06-14 |
| 7955952 | Crackstop structures and methods of making same | Chih-Chao Yang, Haining Yang | 2011-06-07 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Michael Lane, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-06-07 |
| 7947907 | Electronics structures using a sacrificial multi-layer hardmask scheme | Matthew E. Colburn, Ricardo A. Donaton, Conal E. Murray, Satyanarayana V. Nitta, Sampath Purushothaman +2 more | 2011-05-24 |
| 7935588 | Enhanced transistor performance by non-conformal stressed layers | Bruce B. Doris | 2011-05-03 |
| 7902541 | Semiconductor nanowire with built-in stress | Lidija Sekaric, Dureseti Chidambarrao | 2011-03-08 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Christopher V. Jahnes, Paul A. Lauro +2 more | 2011-02-08 |
| 7847402 | BEOL interconnect structures with improved resistance to stress | Darryl D. Restaino, Griselda Bonilla, Christos D. Dimitrakopoulos, Stephen M. Gates, Jae Hak Kim +4 more | 2010-12-07 |
| 7848135 | Piezo-driven non-volatile memory cell with hysteretic resistance | Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martyna, Martin Muser, Dennis M. Newns | 2010-12-07 |
| 7790577 | Crackstop structures and methods of making same | Chih-Chao Yang, Haining Yang | 2010-09-07 |
| 7678673 | Strengthening of a structure by infiltration | Elbert E. Huang, William Francis Landers, Michael Lane, Eric G. Liniger, David L. Questad +1 more | 2010-03-16 |
| 7622737 | Test structures for electrically detecting back end of the line failures and methods of making and using the same | Mukta G. Farooq, Ian D. Melville | 2009-11-24 |
| 7579069 | Negative coefficient of thermal expansion particles and method of forming the same | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Joseph Zinter, Michael J. Rooks +2 more | 2009-08-25 |
| 7556979 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Christopher V. Jahnes, Paul A. Lauro +2 more | 2009-07-07 |
| 7525161 | Strained MOS devices using source/drain epitaxy | Meikei Ieong, Qiqing C. Ouyang, Siddhartha Panda, Haizhou Yin | 2009-04-28 |
| 7491965 | Heat-shielded low power PCM-based reprogrammable eFUSE device | James P. Doyle, Bruce G. Elmegreen, Lia Krusin-Elbaum, Chung H. Lam, Dennis M. Newns +1 more | 2009-02-17 |
| 7485582 | Hardmask for improved reliability of silicon based dielectrics | Son V. Nguyen, Michael Lane, Stephen M. Gates, Vincent J. McGahay, Sanjay C. Mehta +1 more | 2009-02-03 |
| 7456098 | Building metal pillars in a chip for structure support | Habib Hichri, Vincent J. McGahay, Conal E. Murray, Jawahar P. Nayak, Thomas M. Shaw | 2008-11-25 |