Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12267962 | Capacitor-wire-embedded wiring board | — | 2025-04-01 |
| 12080479 | Chip capacitor including capacitor wires | — | 2024-09-03 |
| 11508681 | Semiconductor package and method of fabricating the same | Younhee Kang, Junghyun Roh | 2022-11-22 |
| 11315803 | Stress mitigation in organic laminates | Sri M. Sri-Jayantha | 2022-04-26 |
| 10777495 | Printed circuit board and semiconductor package including the same | — | 2020-09-15 |
| 10147616 | Package frame and method of manufacturing semiconductor package using the same | Geunwoo KIM, Keunho Jang, Younjo Mun | 2018-12-04 |
| 10134666 | Package substrate, method for fabricating the same, and package device including the package substrate | Kyujin Lee | 2018-11-20 |
| 9960107 | Package substrate, method for fabricating the same, and package device including the package substrate | Kyujin Lee | 2018-05-01 |
| 9402315 | Semiconductor package having magnetic connection member | Hyunsuk Chun, Seungbae Lee, Sangsu Ha | 2016-07-26 |
| 9393633 | Method of joining a chip on a substrate | Pascal Blais, Paul F. Fortier, Kang-Wook Lee, Jae-Woong Nah, Robert L. Toutant +1 more | 2016-07-19 |
| 9397052 | Semiconductor package | Hyunsuk Chun | 2016-07-19 |
| 9391009 | Semiconductor packages including heat exhaust part | Eon Soo Jang, Kyol Park, Jongwoo Park, Jin-Kwon Bae, Yunhyeok Im +1 more | 2016-07-12 |
| 8877566 | Curvilinear heat spreader/lid with improved heat dissipation | Michael A. Gaynes, Maurice McGlashan-Powell, Edward J. Yarmchuk | 2014-11-04 |
| 8352230 | Integrated framework for finite-element methods for package, device and circuit co-design | Keunwoo Kim | 2013-01-08 |
| 8269340 | Curvilinear heat spreader/lid with improved heat dissipation | Michael A. Gaynes, Maurice McGlashan-Powell, Edward J. Yarmchuk | 2012-09-18 |
| 7516674 | Method and apparatus for thermally induced testing of materials under transient temperature | Claudius Feger | 2009-04-14 |