| 12267962 |
Capacitor-wire-embedded wiring board |
— |
2025-04-01 |
| 12080479 |
Chip capacitor including capacitor wires |
— |
2024-09-03 |
| 11508681 |
Semiconductor package and method of fabricating the same |
Younhee Kang, Junghyun Roh |
2022-11-22 |
| 11315803 |
Stress mitigation in organic laminates |
Sri M. Sri-Jayantha |
2022-04-26 |
| 10777495 |
Printed circuit board and semiconductor package including the same |
— |
2020-09-15 |
| 10147616 |
Package frame and method of manufacturing semiconductor package using the same |
Geunwoo KIM, Keunho Jang, Younjo Mun |
2018-12-04 |
| 10134666 |
Package substrate, method for fabricating the same, and package device including the package substrate |
Kyujin Lee |
2018-11-20 |
| 9960107 |
Package substrate, method for fabricating the same, and package device including the package substrate |
Kyujin Lee |
2018-05-01 |
| 9402315 |
Semiconductor package having magnetic connection member |
Hyunsuk Chun, Seungbae Lee, Sangsu Ha |
2016-07-26 |
| 9393633 |
Method of joining a chip on a substrate |
Pascal Blais, Paul F. Fortier, Kang-Wook Lee, Jae-Woong Nah, Robert L. Toutant +1 more |
2016-07-19 |
| 9397052 |
Semiconductor package |
Hyunsuk Chun |
2016-07-19 |
| 9391009 |
Semiconductor packages including heat exhaust part |
Eon Soo Jang, Kyol Park, Jongwoo Park, Jin-Kwon Bae, Yunhyeok Im +1 more |
2016-07-12 |
| 8877566 |
Curvilinear heat spreader/lid with improved heat dissipation |
Michael A. Gaynes, Maurice McGlashan-Powell, Edward J. Yarmchuk |
2014-11-04 |
| 8352230 |
Integrated framework for finite-element methods for package, device and circuit co-design |
Keunwoo Kim |
2013-01-08 |
| 8269340 |
Curvilinear heat spreader/lid with improved heat dissipation |
Michael A. Gaynes, Maurice McGlashan-Powell, Edward J. Yarmchuk |
2012-09-18 |
| 7516674 |
Method and apparatus for thermally induced testing of materials under transient temperature |
Claudius Feger |
2009-04-14 |
