Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10591979 | Battery management in a device with multiple batteries | Daniel J. Dummer, Wei Guo, Stephen C. Cooper, Ceceli Ann Wilhelmi, Minsoo Kim | 2020-03-17 |
| 9099458 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha | 2015-08-04 |
| 8866026 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha | 2014-10-21 |
| 8766449 | Variable interconnect geometry for electronic packages and fabrication methods | Suresh K. Sitaraman, Thomas Sokol | 2014-07-01 |
| 8522430 | Clustered stacked vias for reliable electronic substrates | Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha | 2013-09-03 |
| 8382489 | Compliant off-chip interconnects for use in electronic packages and fabrication methods | Suresh K. Sitaraman | 2013-02-26 |
| 8258410 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha | 2012-09-04 |
| 8242593 | Clustered stacked vias for reliable electronic substrates | Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha | 2012-08-14 |
| 8206160 | Compliant off-chip interconnects for use in electronic packages | Suresh K. Sitaraman | 2012-06-26 |