Karan Kacker — 9 Patents at IBM

Karan Kacker has been granted 9 US patents while listed as an inventor at IBM. The first was granted in 2012 and the most recent in March 2020. Karan Kacker ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Karan Kacker in Atlanta, GA, US.

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10591979	Battery management in a device with multiple batteries	Daniel J. Dummer, Wei Guo, Stephen C. Cooper, Ceceli Ann Wilhelmi, Minsoo Kim	2020-03-17	$74,735,000
9099458	Construction of reliable stacked via in electronic substrates—vertical stiffness control method	Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha	2015-08-04	$5,566,000
8866026	Construction of reliable stacked via in electronic substrates—vertical stiffness control method	Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha	2014-10-21	$3,429,000
8766449	Variable interconnect geometry for electronic packages and fabrication methods	Suresh K. Sitaraman, Thomas Sokol	2014-07-01
8522430	Clustered stacked vias for reliable electronic substrates	Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha	2013-09-03	$4,698,000
8382489	Compliant off-chip interconnects for use in electronic packages and fabrication methods	Suresh K. Sitaraman	2013-02-26
8258410	Construction of reliable stacked via in electronic substrates—vertical stiffness control method	Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha	2012-09-04	$6,762,000
8242593	Clustered stacked vias for reliable electronic substrates	Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha	2012-08-14	$4,482,000
8206160	Compliant off-chip interconnects for use in electronic packages	Suresh K. Sitaraman	2012-06-26

Karan Kacker — 9 Patents

Issued Patents All Time

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