Issued Patents All Time
Showing 26–50 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8853007 | In-plane silicon heat spreader and method therefor | Kerry Bernstein | 2014-10-07 |
| 8766817 | Road hazard detection and warning system and method | — | 2014-07-01 |
| 8685833 | Stress reduction means for warp control of substrates through clamping | Vijayeshwar D. Khanna | 2014-04-01 |
| 8659119 | Electronic components on trenched substrates and method of forming same | Vijayeshwar D. Kharma, Jennifer V. Muncy, Arun Sharma, Lorenzo Valdevit, David L. Questad | 2014-02-25 |
| 8600572 | Smarter-grid: method to forecast electric energy production and utilization subject to uncertain environmental variables | — | 2013-12-03 |
| 8522430 | Clustered stacked vias for reliable electronic substrates | Karan Kacker, Douglas O. Powell, David L. Questad, David J. Russell | 2013-09-03 |
| 8345955 | Characterizing thermomechanical properties of an organic substrate using finite element analysis | Hien Dang, Arun Sharma | 2013-01-01 |
| 8322980 | Heat transfer device in a rotating structure | Vijayeshwar D. Khanna, Gerard McVicker | 2012-12-04 |
| 8258410 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Karan Kacker, Douglas O. Powell, David L. Questad, David J. Russell | 2012-09-04 |
| 8242593 | Clustered stacked vias for reliable electronic substrates | Karan Kacker, Douglas O. Powell, David L. Questad, David J. Russell | 2012-08-14 |
| 8235593 | Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit | Hien Dang, Arun Sharma | 2012-08-07 |
| 8127255 | Method to extract and apply circuit features in organic substrate for automation of warp modeling | Hien Dang, Vijayeshwar D. Khanna, Arun Sharma | 2012-02-28 |
| 8096705 | Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit | Hien Dang, Arun Sharma | 2012-01-17 |
| 8085550 | Implementing enhanced solder joint robustness for SMT pad structure | Mark K. Hoffmeyer, Steven P. Ostrander | 2011-12-27 |
| 8056027 | Characterizing thermomechanical properties of an organic substrate using three-dimensional finite element analysis | Hien Dang, Vijaveshwar Das Khanna, Arun Sharma | 2011-11-08 |
| 8054630 | Electronic components on trenched substrates and method of forming same | David L. Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Lorenzo Valdevit | 2011-11-08 |
| 8047421 | Elliptic C4 with optimal orientation for enhanced reliability in electronic packages | Lorenzo Valdevit | 2011-11-01 |
| 7964444 | Method and apparatus for manufacturing electronic integrated circuit chip | — | 2011-06-21 |
| 7928548 | Silicon heat spreader mounted in-plane with a heat source and method therefor | Kerry Bernstein | 2011-04-19 |
| 7901998 | Packaging substrate having pattern-matched metal layers | Hien Dang, Vijayeshwar D. Khanna, Arun Sharma | 2011-03-08 |
| 7904185 | System and method for sensor replication for ensemble averaging in micro-electromechanical system (MEMS) | Arun Sharma, Hien Dang, Evangelos S. Eleftheriou, Mark A. Lantz, Charalampos Pozidis | 2011-03-08 |
| 7896611 | Heat transfer device in a rotating structure | Vijayeshwar D. Khanna, Gerard McVicker | 2011-03-01 |
| 7855430 | Electronic components on trenched substrates and method of forming same | David L. Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Lorenzo Valdevit | 2010-12-21 |
| 7841508 | Elliptic C4 with optimal orientation for enhanced reliability in electronic packages | Lorenzo Valdevit | 2010-11-30 |
| 7836353 | Method to enhance micro-C4 reliability by reducing the impact of hot spot pulsing | John U. Knickerbocker, Gerard McVicker | 2010-11-16 |