SO

Steven P. Ostrander

IBM: 31 patents #3,235 of 70,183Top 5%
AU Alfred University: 6 patents #4 of 62Top 7%
Globalfoundries: 3 patents #1,029 of 4,424Top 25%
ET Elpis Technologies: 1 patents #31 of 121Top 30%
JU Jds Uniphase: 1 patents #393 of 940Top 45%
📍 Poughkeepsie, NY: #89 of 1,613 inventorsTop 6%
🗺 New York: #2,449 of 115,490 inventorsTop 3%
Overall (All Time): #72,554 of 4,157,543Top 2%
42
Patents All Time

Issued Patents All Time

Showing 26–42 of 42 patents

Patent #TitleCo-InventorsDate
7079393 Fluidic cooling systems and methods for electronic components Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman +7 more 2006-07-18
6908025 Preparing MCM hat for removal Patrick A. Coico, Sudipta K. Ray 2005-06-21
6836015 Optical assemblies for transmitting and manipulating optical beams Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Brenda Peterson, Mark V. Pierson +2 more 2004-12-28
6827505 Optoelectronic package structure and process for planar passive optical and optoelectronic devices Subhash L. Shinde, L. Wynn Herron, Mario J. Interrante, How T. Lin, Sudipta K. Ray +2 more 2004-12-07
6821026 Redundant configurable VCSEL laser array optical light source William T. Devine, Jeffrey A. Kash, John U. Knickerbocker, Jeannine M. Trewhella, Ronald P. Luijten 2004-11-23
6819813 Optical land grid array interposer Stephen Howland, John U. Knickerbocker, Martin Schmatz 2004-11-16
6502999 Opto-electronic transceiver module and hermetically sealed housing therefore Mitchell S. Cohen, David Peter Gaio, William K. Hogan, Sudipta K. Ray, Jeannine M. Trewhella 2003-01-07
6197222 Lead free conductive composites for electrical interconnections Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Richard B. Booth, Emanuel I. Cooper +1 more 2001-03-06
5866044 Lead free conductive composites for electrical interconnections Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Richard B. Booth, Emanuel I. Cooper +1 more 1999-02-02
5813870 Selectively filled adhesives for semiconductor chip interconnection and encapsulation Michael A. Gaynes, Jaynal A. Molla, Judith Marie Roldan, George J. Saxenmeyer, Jr., George F. Walker 1998-09-29
5716565 Process for making ultra-fine stabilized zirconia particles Gregory C. Stangle, Koththavasal R. Venkatachari, Walter A. Schulze, Amy B. Jedlicka 1998-02-10
5660773 Process for making ultra-fine yttrium-iron-garnet particles Gregory C. Stangle, Koththavasal R. Venkatachari, Walter A. Schulze, John D. Pietras 1997-08-26
5660772 Process for making ultra-fine barium hexaferrite particles Gregory C. Stangle, Koththavasal R. Venkatachari, Walter A. Schulze, John D. Pietras 1997-08-26
5660774 Process for making a sintered body from ultra-fine superconductive particles Gregory C. Stangle, Koththavasal R. Venkatachari, Walter A. Schulze, John D. Pietras 1997-08-26
5545429 Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess Richard B. Booth, Emanuel I. Cooper, Edward A. Giess, Mark R. Kordus, Sol Krongelb +3 more 1996-08-13
5523065 Process for making ultra-fine barium titanate particles Gregory C. Stangle, Koththavasal R. Venkatachari, Walter A. Schulze 1996-06-04
5468427 Process for making ultra-fine ceramic particles Gregory C. Stangle, Koththavasal R. Venkatachari, Walter A. Schulze 1995-11-21