Issued Patents All Time
Showing 26–50 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7312523 | Enhanced via structure for organic module performance | Jean Audet, Luc Guerin, David L. Questad, David J. Russell | 2007-12-25 |
| 7294909 | Electronic package repair process | James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks, Richard F. Indyk +13 more | 2007-11-13 |
| 7288474 | Suspension for filling via holes in silicon and method for making the same | Brian R. Sundlof | 2007-10-30 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same | Daniel C. Edelstein, Paul S. Andry, Leena Paivikki Buchwalter, Sherif A. Goma, Raymond R. Horton +9 more | 2007-10-02 |
| 7202154 | Suspension for filling via holes in silicon and method for making the same | Brian R. Sundlof | 2007-04-10 |
| 7199450 | Materials and method to seal vias in silicon substrates | Michael Berger, Leena Paivikki Buchwalter, Donald F. Canaperi, Raymond R. Horton, Anurag Jain +2 more | 2007-04-03 |
| 7078259 | Method for integrating thermistor | William J. Ferrante, Edward W. Kiewra, Carl Radens, William R. Tonti | 2006-07-18 |
| 7015581 | Low-K dielectric material system for IC application | Daniel C. Edelstein | 2006-03-21 |
| 6916670 | Electronic package repair process | James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks, Richard F. Indyk +13 more | 2005-07-12 |
| 6878616 | Low-k dielectric material system for IC application | Daniel C. Edelstein | 2005-04-12 |
| 6823585 | Method of selective plating on a substrate | Mark J. LaPlante, Thomas A. Wassick, David C. Long, Krystyna W. Semkow, Patrick E. Spencer +8 more | 2004-11-30 |
| 6562169 | Multi-level web structure in use for thin sheet processing | Govindarajan Natarajan, Raschid J. Bezama, Amy C. Flack, Robert W. Pasco, Arnold W. Terpening +1 more | 2003-05-13 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste | Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak +2 more | 2002-11-05 |
| 6423174 | Apparatus and insertless method for forming cavity substrates using coated membrane | Govindarajan Natarajan, Robert W. Pasco, Vincent P. Peterson | 2002-07-23 |
| 6413339 | Low temperature sintering of ferrite materials | Govindarajan Natarajan, Martin Klepeis, John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita +1 more | 2002-07-02 |
| 6402866 | Powdered metallic sheet method for deposition of substrate conductors | John U. Knickerbocker, David C. Long, Brenda Peterson | 2002-06-11 |
| 6278049 | Thermoelectric devices and methods for making the same | Gregory M. Johnson, Scott R. Dwyer, David C. Long, Kevin M. Prettyman | 2001-08-21 |
| 6262357 | Thermoelectric devices and methods for making the same | Gregory M. Johnson, Scott R. Dwyer, David C. Long, Kevin M. Prettyman | 2001-07-17 |
| 6177184 | Method of making an interface layer for stacked lamination sizing and sintering | Michael A. Cohn, Michael E. Cropp, Candace A. Sullivan, Robert J. Sullivan, Andrew H. Vogel | 2001-01-23 |
| 6156091 | Controlled porosity for ceramic contact sheets and setter tiles | — | 2000-12-05 |
| 6121539 | Thermoelectric devices and methods for making the same | Gregory M. Johnson, Scott R. Dwyer, David C. Long, Kevin M. Prettyman | 2000-09-19 |
| 6032683 | System for cleaning residual paste from a mask | Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, John U. Knickerbocker, David C. Long +8 more | 2000-03-07 |
| 6015517 | Controlled porosity for ceramic contact sheets and setter tiles | — | 2000-01-18 |
| 5948193 | Process for fabricating a multilayer ceramic substrate from thin greensheet | Michael A. Cohn, Christopher N. Collins, Robert A. Rita, Robert J. Sullivan, Adrienne M. Tirch +2 more | 1999-09-07 |
| 5927193 | Process for via fill | James G. Balz, Cynthia J. Calli, David C. Long, Daniel S. Mackin, Keith C. O'Neil +2 more | 1999-07-27 |