Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Enhanced thermal management for improved module reliability

Enhanced thermal management for improved module reliability

US Patent 8214658 · Granted Jul 3, 2012

Estimated economic value: $4,930,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lab scanner2025
Providing deterministic frequency and voltage enhancements for a processor2025
Proxy-based instruction throttling control2024
Current prediction-based instruction throttling control2024
Electronic device console with natural draft cooling2023
Current prediction-based instruction throttling control2023
Mitigating moisture-driven degradation of features designed to prevent structura2023
Current measurement in power-gated microprocessors2022
Lid/heat spreader having targeted flexibility2022
Polygon integrated circuit (IC) packaging2022
Optimized weight heat spreader for an electronic package2022
Direct bonded heterogeneous integration packaging structures2021