Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8650512 | Elastic modulus mapping of an integrated circuit chip in a chip/device package | Timothy H. Daubenspeck, Mark C. H. Lamorey, Xiao Hu Liu, Thomas M. Shaw | 2014-02-11 |
| 8575007 | Selective electromigration improvement for high current C4s | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-11-05 |
| 8487447 | Semiconductor structure having offset passivation to reduce electromigration | Mario J. Interrante, Gary LaFontant, Michael J. Shapiro, Bucknell C. Webb | 2013-07-16 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2013-05-21 |
| 8298929 | Offset solder vias, methods of manufacturing and design structures | Timothy H. Daubenspeck, Gary LaFontant, Ekta Misra, David L. Questad, George J. Scott +3 more | 2012-10-30 |
| 7875502 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, Ian D. Melville, David L. Questad, Wolfgang Sauter | 2011-01-25 |
| 7732932 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, Ian D. Melville, David L. Questad, Wolfgang Sauter | 2010-06-08 |
| 7716992 | Sensor, method, and design structure for a low-k delamination sensor | John J. Maloney, Wolfgang Sauter, Jeffrey S. Zimmerman | 2010-05-18 |
| 7294909 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2007-11-13 |
| 7019402 | Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor | Paul S. Andry, Leena Paivikki Buchwalter, Russell A. Budd | 2006-03-28 |
| 6916670 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2005-07-12 |
| 6823585 | Method of selective plating on a substrate | Mark J. LaPlante, Jon A. Casey, David C. Long, Krystyna W. Semkow, Patrick E. Spencer +8 more | 2004-11-30 |
| 6682872 | UV-curable compositions and method of use thereof in microelectronics | Krishna G. Sachdev, Michael Berger, Rebecca Y. Gorrell, Gregg B. Monjeau, Bernadette H. Perry | 2004-01-27 |
| 6541709 | Inherently robust repair process for thin film circuitry using uv laser | Peter A. Franklin, Arthur G. Merryman, Rajesh S. Patel | 2003-04-01 |
| 6455331 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2002-09-24 |
| 6444919 | Thin film wiring scheme utilizing inter-chip site surface wiring | Laertis Economikos, Mukta S. Farooq, Michael F. McAllister, Eric D. Perfecto, Chandrika Prasad +3 more | 2002-09-03 |
| 6427324 | Inherently robust repair process for thin film circuitry using UV laser | Peter A. Franklin, Arthur G. Merryman, Rajesh S. Patel | 2002-08-06 |
| 6323045 | Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join process | Christopher Cline, Nancy Wagner Hannon, Chandrika Prasad, Roy Yu | 2001-11-27 |
| 6248599 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2001-06-19 |
| 6235544 | Seed metal delete process for thin film repair solutions using direct UV laser | Peter A. Franklin, Charles J. Hendricks, Richard P. Surprenant, Stephen J. Tirch, III, James Wood | 2001-05-22 |
| 6054749 | Thin film device repaired using enhanced repair process | Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia +3 more | 2000-04-25 |
| 6048741 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2000-04-11 |
| 6002267 | In-line voltage plane tests for multi-chip modules | Ashwani K. Malhotra, John R. Pennacchia, Ronald R. Shields | 1999-12-14 |
| 5972723 | Enhanced thin film wiring net repair process | Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia +3 more | 1999-10-26 |
| 5937269 | Graphics assisted manufacturing process for thin-film devices | Roy Yu, Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman +3 more | 1999-08-10 |