Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324669 | Use of electrolytic plating to control solder wetting | Charles L. Arvin, Eric D. Perfecto, Wolfgang Sauter | 2016-04-26 |
| 9214385 | Semiconductor device including passivation layer encapsulant | Karen P. McLaughlin, Ekta Misra | 2015-12-15 |
| 9190376 | Organic coating to inhibit solder wetting on pillar sidewalls | Charles L. Arvin, Eric D. Perfecto, Wolfgang Sauter, Thomas A. Wassick | 2015-11-17 |
| 8710656 | Redistribution layer (RDL) with variable offset bumps | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, George J. Scott | 2014-04-29 |
| 8686749 | Thermal interface material, test structure and method of use | David L. Gardell, James N. Humenik, Rajneesh Kumar, John R. Lawson | 2014-04-01 |
| 8563416 | Coaxial solder bump support structure | Ian D. Melville, Ekta Misra, George J. Scott | 2013-10-22 |