Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon | 2011-12-13 |
| 8022543 | Underbump metallurgy for enhanced electromigration resistance | Mukta G. Farooq, Robert Hannon, Emily R. Kinser | 2011-09-20 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon | 2011-06-07 |
| 7919356 | Method and structure to reduce cracking in flip chip underfill | Mukta G. Farooq, Robert Hannon, Dae Young Jung | 2011-04-05 |
| 7875502 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, David L. Questad, Wolfgang Sauter, Thomas A. Wassick | 2011-01-25 |
| 7867887 | Structure and method for enhancing resistance to fracture of bonding pads | Mukta G. Farooq, Dae Young Jung | 2011-01-11 |
| 7816248 | Solder connector structure and method | Mukta G. Farooq, Lacrtis Economikos, Kevin S. Petrarca, Richard P. Volant | 2010-10-19 |
| 7732932 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, David L. Questad, Wolfgang Sauter, Thomas A. Wassick | 2010-06-08 |
| 7648891 | Semiconductor chip shape alteration | Mukta G. Farooq, Dae Young Jung | 2010-01-19 |
| 7622737 | Test structures for electrically detecting back end of the line failures and methods of making and using the same | Mukta G. Farooq, Xiao Hu Liu | 2009-11-24 |
| 7573115 | Structure and method for enhancing resistance to fracture of bonding pads | Mukta G. Farooq, Dae Young Jung | 2009-08-11 |
| 7470985 | Solder connector structure and method | Mukta G. Farooq, Laertis Economikos, Kevin S. Petrarca, Richard P. Volant | 2008-12-30 |
| 7375021 | Method and structure for eliminating aluminum terminal pad material in semiconductor devices | Daniel C. Edelstein, Mukta G. Farooq, Robert Hannon | 2008-05-20 |
| 6831363 | Structure and method for reducing thermo-mechanical stress in stacked vias | Timothy J. Dalton, Sanjit Das, Brett H. Engel, Brian Herbst, Habib Hichri +8 more | 2004-12-14 |