Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8455998 | Method and package for circuit chip packaging | Sushumna Iruvanti, Yves Martin, Xiaojin Wei | 2013-06-04 |
| 8053284 | Method and package for circuit chip packaging | Sushumna Iruvanti, Yves Martin, Xiaojin Wei | 2011-11-08 |