Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2013-05-21 |
| 8299608 | Enhanced thermal management of 3-D stacked die packaging | Gerald K. Bartley, David R. Motschman, Kamal K. Sikka, Jamil A. Wakil, Jiantao Zheng | 2012-10-30 |
| 8274301 | On-chip accelerated failure indicator | Kai D. Feng, Thomas J. Fleischman, Ping-Chuan Wang, Zhijian Yang | 2012-09-25 |
| 8115303 | Semiconductor package structures having liquid coolers integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Kenneth C. Marston | 2012-02-14 |
| 8053284 | Method and package for circuit chip packaging | Sushumna Iruvanti, Yves Martin, Theodore Kessel | 2011-11-08 |
| 8030113 | Thermoelectric 3D cooling | Louis L. Hsu, Ping-Chuan Wang, Huilong Zhu | 2011-10-04 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera +3 more | 2011-04-19 |
| 7893529 | Thermoelectric 3D cooling | Louis L. Hsu, Ping-Chuan Wang, Huilong Zhu | 2011-02-22 |
| 7812438 | Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging | Virendra R. Jadhav, David L. Questad, Kamal K. Sikka, Jiantao Zheng | 2010-10-12 |
| 7759789 | Local area semiconductor cooling system | Kai D. Feng, Alvin J. Joseph, Donald J. Papae | 2010-07-20 |
| 7414843 | Method and apparatus for a layered thermal management arrangement | Yogendra Joshi, Michael Patterson | 2008-08-19 |