Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7948555 | Camera module and electronic apparatus having the same | Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee, Hyung-Sun Jang | 2011-05-24 |
| 7893514 | Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package | Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee, Hyung-Sun Jang | 2011-02-22 |
| 7884392 | Image sensor having through via | Hyuek Jae Lee, Tae-Je Cho, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee +1 more | 2011-02-08 |
| 7786581 | Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device | Un-Byoung Kang, Yong-Hwan Kwon, Chung-Sun Lee, Hyung-Sun Jang | 2010-08-31 |
| 7619315 | Stack type semiconductor chip package having different type of chips and fabrication method thereof | Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee, Hyung-Sun Jang | 2009-11-17 |
| 6514560 | Method for manufacturing conductive adhesive for high frequency flip chip package applications | Kyung Wook Paik, Myung Jin Yim | 2003-02-04 |