{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications", "item": "https://www.patentleaderboard.com/patent/10896873"}]}
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Home › Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications

Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications

US Patent 10896873 · Granted Jan 19, 2021

Estimated economic value: $86,250,000 ⓘ

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