Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12274079 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Teckgyu Kang, Woon-Seong Kwon | 2025-04-08 |
| 11784215 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Teckgyu Kang, Woon-Seong Kwon | 2023-10-10 |
| 10892316 | High density ball grid array (BGA) package capacitor design | — | 2021-01-12 |
| 7007741 | Conformal heat spreader | Bidyut Sen, Vadim Gektin | 2006-03-07 |
| 6137168 | Semiconductor package with traces routed underneath a die | — | 2000-10-24 |
| 6064113 | Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances | — | 2000-05-16 |
| 5992012 | Method for making electrical interconnections between layers of an IC package | — | 1999-11-30 |
| 5911112 | Method for forming electrical connections between a semiconductor die and a semiconductor package | — | 1999-06-08 |
| 5903050 | Semiconductor package having capacitive extension spokes and method for making the same | Aritharan Thurairajaratnam, Wheling Cheng | 1999-05-11 |
| 5793104 | Apparatus for forming electrical connections between a semiconductor die and a semiconductor package | — | 1998-08-11 |
| 5337614 | Fixture for testing mounting integrity of heat sinks on semiconductor packages, and method of testing | Xin Jiang | 1994-08-16 |