Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10548239 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Gregory Sizikov, Yuan Li, Jorge Padilla, Woon-Seong Kwon | 2020-01-28 |
| 10548240 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon +1 more | 2020-01-28 |
| 10515920 | High bandwidth memory package for high performance processors | Woon-Seong Kwon, Nam Hoon Kim | 2019-12-24 |
| 10468359 | Package stiffener for protecting semiconductor die | William Frank Edwards, Erick Tuttle, Madhusudan K. Iyengar, Yuan Li, Jorge Padilla +1 more | 2019-11-05 |
| 10257921 | Embedded air gap transmission lines | Richard Stuart Roy, Pierre-Luc Cantin, Woon-Seong Kwon | 2019-04-09 |
| 10083920 | Package stiffener for protecting semiconductor die | William Frank Edwards, Erick Tuttle, Madhusudan K. Iyengar, Yuan Li, Jorge Padilla +1 more | 2018-09-25 |
| 10032696 | Chip package using interposer substrate with through-silicon vias | — | 2018-07-24 |
| 10025047 | Integration of silicon photonics IC for high data rate | Hong Liu, Ryohei Urata, Woon-Seong Kwon | 2018-07-17 |
| 9659815 | System, method, and computer program product for a cavity package-on-package structure | Ronilo Boja, Abraham Yee | 2017-05-23 |
| 9425171 | Removable substrate for controlling warpage of an integrated circuit package | Joseph Minacapelli | 2016-08-23 |