Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11201095 | Chip package having a cover with window | Inderjit Singh, Gerilyn Maloney, Chandan Bhat | 2021-12-14 | $77,026,000 |
| 10764996 | Chip package assembly with composite stiffener | Inderjit Singh | 2020-09-01 | $23,756,000 |
| 10438863 | Chip package assembly with surface mounted component protection | Inderjit Singh | 2019-10-08 | $73,666,000 |
| 10219387 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Leilei Zhang, Abraham Yee, Zuhair Bokharey | 2019-02-26 | $135,756,000 |
| 9659815 | System, method, and computer program product for a cavity package-on-package structure | Teckgyu Kang, Abraham Yee | 2017-05-23 | $185,383,000 |
| 8810028 | Integrated circuit packaging devices and methods | Nael Zohni, Kumar Nagarajan | 2014-08-19 | $15,329,000 |
| 5381641 | BGA funnel | Mohsen Hosseinmardi | 1995-01-17 | $36,425,000 |