| 11973060 |
Extended through wafer vias for power delivery in face-to-face dies |
Joseph Greco |
2024-04-30 |
| 11699662 |
Face-to-face dies with probe pads for pre-assembly testing |
Joseph Greco |
2023-07-11 |
| 11616023 |
Face-to-face dies with a void for enhanced inductor performance |
Joseph Greco |
2023-03-28 |
| 11127719 |
Face-to-face dies with enhanced power delivery using extended TSVS |
Joseph Greco |
2021-09-21 |
| 9728481 |
System with a high power chip and a low power chip having low interconnect parasitics |
Abraham Yee, Joe Greco, Jun Zhai, John Chen |
2017-08-08 |
| 9425171 |
Removable substrate for controlling warpage of an integrated circuit package |
Teckgyu Kang |
2016-08-23 |
| 8698305 |
Multi-configuration GPU interface device |
Thomas E. Dewey, James K. Dobbins, Simon Thomas |
2014-04-15 |
| 7353480 |
Apparatus, system, and method for designing via pads having extended contours |
— |
2008-04-01 |
| 6797998 |
Multi-configuration GPU interface device |
Thomas E. Dewey, James K. Dobbins, Simon Thomas |
2004-09-28 |