Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973060 | Extended through wafer vias for power delivery in face-to-face dies | Joseph Greco | 2024-04-30 |
| 11699662 | Face-to-face dies with probe pads for pre-assembly testing | Joseph Greco | 2023-07-11 |
| 11616023 | Face-to-face dies with a void for enhanced inductor performance | Joseph Greco | 2023-03-28 |
| 11127719 | Face-to-face dies with enhanced power delivery using extended TSVS | Joseph Greco | 2021-09-21 |
| 9728481 | System with a high power chip and a low power chip having low interconnect parasitics | Abraham Yee, Joe Greco, Jun Zhai, John Chen | 2017-08-08 |
| 9425171 | Removable substrate for controlling warpage of an integrated circuit package | Teckgyu Kang | 2016-08-23 |
| 8698305 | Multi-configuration GPU interface device | Thomas E. Dewey, James K. Dobbins, Simon Thomas | 2014-04-15 |
| 7353480 | Apparatus, system, and method for designing via pads having extended contours | — | 2008-04-01 |
| 6797998 | Multi-configuration GPU interface device | Thomas E. Dewey, James K. Dobbins, Simon Thomas | 2004-09-28 |