Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Face-to-face dies with probe pads for pre-assembly testing

Face-to-face dies with probe pads for pre-assembly testing

US Patent 11699662 · Granted Jul 11, 2023

Estimated economic value: $2,115,530,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Extended through wafer vias for power delivery in face-to-face dies2024
Extended through wafer vias for power delivery in face-to-face dies2024
Face-to-face dies with a void for enhanced inductor performance2023
Face-to-face dies with a void for enhanced inductor performance2023
Face-to-face dies with enhanced power delivery using extended TSVS2021
Face-to-face dies with enhanced power delivery using extended TSVS2021
System with a high power chip and a low power chip having low interconnect paras2017
Removable substrate for controlling warpage of an integrated circuit package2016
Multi-configuration GPU interface device2014
Apparatus, system, and method for graphics memory hub2012
Method of fabricating a pad over active circuit I.C. with frame support structur2011
Pad over active circuit system and method with meshed support structure2010