Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Removable substrate for controlling warpage of an integrated circuit package

Removable substrate for controlling warpage of an integrated circuit package

US Patent 9425171 · Granted Aug 23, 2016

Estimated economic value: $24,893,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Socket to support high performance multi-die ASICs2025
Backside integrated voltage regulator for integrated circuits2025
ASIC package with photonics and vertical power delivery2025
Integrated circuit package for high bandwidth memory2025
Backside integrated voltage regulator for integrated circuits2025
Deep trench capacitors embedded in package substrate2025
Methods and heat distribution devices for thermal management of chip assemblies2025
Backside interconnection interface die for integrated circuits package2024
Methods and heat distribution devices for thermal management of chip assemblies2024
Integrated circuit package for high bandwidth memory2024
ASIC package with photonics and vertical power delivery2024
Extended through wafer vias for power delivery in face-to-face dies2024