Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368324 | Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package | Xiaolei Zhu, Rushuo Tao, Chonghui Sun, Kun Yang | 2025-07-22 |
| 12278138 | Method of manufacturing memory device with first and second isolation members using patterned photoresist layer and energy-decomposable mask | — | 2025-04-15 |
| 12243850 | Devices, systems, and methods for stacked die packages | Dongkai Shangguan | 2025-03-04 |
| 12237209 | Method of manufacturing memory device having active area in elongated block | — | 2025-02-25 |
| 11723151 | Methods of creating exposed cavities in molded electronic devices | Dongkai Shangguan, David Geiger, Venkat Iyer | 2023-08-08 |
| 11699734 | Semiconductor device with resistance reduction element and method for fabricating the same | — | 2023-07-11 |
| 11682603 | Control of thermal interface material in multi-chip package | Dongkai Shangguan | 2023-06-20 |
| 11652151 | Semiconductor device structure with fine conductive contact and method for preparing the same | — | 2023-05-16 |
| 11521978 | Semiconductor device and method for fabricating the same | — | 2022-12-06 |
| 11304302 | Methods of creating exposed cavities in molded electronic devices | Dongkai Shangguan, David Geiger, Venkat Iyer | 2022-04-12 |
| 11270974 | Embedded copper structure for microelectronics package | Dongkai Shangguan, Li Yao | 2022-03-08 |
| 11189622 | Semiconductor device with graphene layer and method for forming the same | — | 2021-11-30 |
| 11114448 | Semiconductor device and method for fabricating the same | — | 2021-09-07 |
| 11114536 | Semiconductor device having multiple dimensions of gate structures and method for fabricating the same | — | 2021-09-07 |
| 10896877 | System in package with double side mounted board | Dongkai Shangguan, Bo Li, Venkat Iyer | 2021-01-19 |
| 10629561 | Overlapping stacked die package with vertical columns | Junfeng Zhao | 2020-04-21 |
| 10620221 | Devices and assays for diagnosis of sinusitis | Aaron Szymanski, David S. Seebauer, Mohan Rajasekaran, John Wysmuller, Michael Mennone +6 more | 2020-04-14 |
| 10256208 | Overlapping stacked die package with vertical columns | Junfeng Zhao | 2019-04-09 |
| 9936582 | Integrated circuit assemblies with molding compound | Junfeng Zhao, Saeed S. Shojaie | 2018-04-03 |
| 8129098 | Colored mask combined with selective area deposition | Lyn M. Irving, Diane C. Freeman, Peter J. Cowdery-Corvan, David H. Levy | 2012-03-06 |
| 8030212 | Process for selective area deposition of inorganic materials | Lyn M. Irving, David H. Levy, Peter J. Cowdery-Corvan, Diane C. Freeman | 2011-10-04 |
| 8017183 | Organosiloxane materials for selective area deposition of inorganic materials | Lyn M. Irving, David H. Levy, Peter J. Cowdery-Corvan, Diane C. Freeman | 2011-09-13 |
| 7846644 | Photopatternable deposition inhibitor containing siloxane | Lyn M. Irving, David H. Levy, Diane C. Freeman, Peter J. Cowdery-Corvan | 2010-12-07 |