Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368324 | Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package | Xiaolei Zhu, Chonghui Sun, Kun Yang, Cheng Yang | 2025-07-22 |