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Wave solder pallets for optimal solder flow and methods of manufacturing |
Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa |
2023-12-26 |
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Methods of creating exposed cavities in molded electronic devices |
Dongkai Shangguan, Venkat Iyer, Cheng Yang |
2023-08-08 |
| 11516924 |
Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components |
Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa |
2022-11-29 |
| 11425848 |
Adjustable carrier with changeable core |
Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa |
2022-08-23 |
| 11304302 |
Methods of creating exposed cavities in molded electronic devices |
Dongkai Shangguan, Venkat Iyer, Cheng Yang |
2022-04-12 |
| 11039531 |
System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features |
Jesus Tan, Anwar Mohammed, Weifeng Liu |
2021-06-15 |
| 10828828 |
Method of manufacturing a part |
Zohair Mehkri, Anwar Mohammed, Murad Kurwa, Jesus Tan |
2020-11-10 |
| 10827626 |
Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components |
Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa |
2020-11-03 |
| 10737344 |
Method of manufacturing a wave solder pallet |
Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa |
2020-08-11 |
| 10231333 |
Copper interconnect for PTH components assembly |
Weifeng Liu, Zhen Feng, Anwar Mohammed, Murad Kurwa |
2019-03-12 |
| 9801277 |
Bellows interconnect |
Weifeng Liu, Zhen Feng, Anwar Mohammed, Murad Kurwa |
2017-10-24 |
| 9699902 |
Printed circuit board made through sintering copper nano-particles |
Weifeng Liu, Anwar Mohammed |
2017-07-04 |
| 9659359 |
Method of and device for quality control process optimization |
Zhen Feng, Weifeng Liu, Anwar Mohammed, Murad Kurwa |
2017-05-23 |
| 9661756 |
Nano-copper pillar interconnects and methods thereof |
Jennifer Nguyen, Anwar Mohammed, Murad Kurwa |
2017-05-23 |
| 9609738 |
Graphite sheet to redirect SMT components during thermal exposure |
Dennis Willie, Richard Loi, Anwar Mohammed, Murad Kurwa, Hector Rene Marin Hernandez |
2017-03-28 |
| 9593939 |
Glue thickness inspection (GTI) |
Hongqiang Xie, An Qi Zhao, Jiyang Zhang, Zhen Feng |
2017-03-14 |
| 9566764 |
Fast cure conductive epoxy attach methodology for high speed automated processes |
Anwar Mohammed, Weifeng Liu, Dennis Willie, Gervasio Mutarelli, Murad Kurwa |
2017-02-14 |
| 9521738 |
Graphite sheet to protect SMT components from thermal exposure |
Dennis Willie, Richard Loi, Anwar Mohammed, Murad Kurwa, Hector Rene Marin Hernandez |
2016-12-13 |
| 9397065 |
Fixture design for pre-attachment package on package component assembly |
Jennifer Nguyen, Ranilo Aranda, Jonas Sjoberg, Anwar Mohammed, Murad Kurwa |
2016-07-19 |
| 8328077 |
PV cell mass reflow |
Dennis Willie, Chris Stratas |
2012-12-11 |
| 7434359 |
Constructing geodesic domes with panels |
— |
2008-10-14 |
| 6996942 |
Constructing geodesic domes |
— |
2006-02-14 |
| 4345410 |
Construction method |
— |
1982-08-24 |