Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850684 | Wave solder pallets for optimal solder flow and methods of manufacturing | Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa | 2023-12-26 |
| 11723151 | Methods of creating exposed cavities in molded electronic devices | Dongkai Shangguan, Venkat Iyer, Cheng Yang | 2023-08-08 |
| 11516924 | Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components | Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa | 2022-11-29 |
| 11425848 | Adjustable carrier with changeable core | Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa | 2022-08-23 |
| 11304302 | Methods of creating exposed cavities in molded electronic devices | Dongkai Shangguan, Venkat Iyer, Cheng Yang | 2022-04-12 |
| 11039531 | System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features | Jesus Tan, Anwar Mohammed, Weifeng Liu | 2021-06-15 |
| 10828828 | Method of manufacturing a part | Zohair Mehkri, Anwar Mohammed, Murad Kurwa, Jesus Tan | 2020-11-10 |
| 10827626 | Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components | Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa | 2020-11-03 |
| 10737344 | Method of manufacturing a wave solder pallet | Zohair Mehkri, Anwar Mohammed, Jesus Tan, Murad Kurwa | 2020-08-11 |
| 10231333 | Copper interconnect for PTH components assembly | Weifeng Liu, Zhen Feng, Anwar Mohammed, Murad Kurwa | 2019-03-12 |
| 9801277 | Bellows interconnect | Weifeng Liu, Zhen Feng, Anwar Mohammed, Murad Kurwa | 2017-10-24 |
| 9699902 | Printed circuit board made through sintering copper nano-particles | Weifeng Liu, Anwar Mohammed | 2017-07-04 |
| 9659359 | Method of and device for quality control process optimization | Zhen Feng, Weifeng Liu, Anwar Mohammed, Murad Kurwa | 2017-05-23 |
| 9661756 | Nano-copper pillar interconnects and methods thereof | Jennifer Nguyen, Anwar Mohammed, Murad Kurwa | 2017-05-23 |
| 9609738 | Graphite sheet to redirect SMT components during thermal exposure | Dennis Willie, Richard Loi, Anwar Mohammed, Murad Kurwa, Hector Rene Marin Hernandez | 2017-03-28 |
| 9593939 | Glue thickness inspection (GTI) | Hongqiang Xie, An Qi Zhao, Jiyang Zhang, Zhen Feng | 2017-03-14 |
| 9566764 | Fast cure conductive epoxy attach methodology for high speed automated processes | Anwar Mohammed, Weifeng Liu, Dennis Willie, Gervasio Mutarelli, Murad Kurwa | 2017-02-14 |
| 9521738 | Graphite sheet to protect SMT components from thermal exposure | Dennis Willie, Richard Loi, Anwar Mohammed, Murad Kurwa, Hector Rene Marin Hernandez | 2016-12-13 |
| 9397065 | Fixture design for pre-attachment package on package component assembly | Jennifer Nguyen, Ranilo Aranda, Jonas Sjoberg, Anwar Mohammed, Murad Kurwa | 2016-07-19 |
| 8328077 | PV cell mass reflow | Dennis Willie, Chris Stratas | 2012-12-11 |
| 7434359 | Constructing geodesic domes with panels | — | 2008-10-14 |
| 6996942 | Constructing geodesic domes | — | 2006-02-14 |
| 4345410 | Construction method | — | 1982-08-24 |