Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156356 | Electronic encapsulation through stencil printing | Weifeng Liu, William L. Uy, Dongkai Shangguan | 2024-11-26 |
| 11850684 | Wave solder pallets for optimal solder flow and methods of manufacturing | Zohair Mehkri, Anwar Mohammed, David Geiger, Murad Kurwa | 2023-12-26 |
| 11516924 | Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components | Zohair Mehkri, Anwar Mohammed, David Geiger, Murad Kurwa | 2022-11-29 |
| 11493414 | Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel | Weifeng Liu, William L. Uy, Dongkai Shangguan | 2022-11-08 |
| 11425848 | Adjustable carrier with changeable core | Zohair Mehkri, Anwar Mohammed, David Geiger, Murad Kurwa | 2022-08-23 |
| 11289393 | Methods, devices, and systems for electronic device molding and encapsulation | Weifeng Liu, William L. Uy, Dongkai Shangguan | 2022-03-29 |
| 11039531 | System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features | Anwar Mohammed, David Geiger, Weifeng Liu | 2021-06-15 |
| 10828828 | Method of manufacturing a part | Zohair Mehkri, Anwar Mohammed, David Geiger, Murad Kurwa | 2020-11-10 |
| 10827626 | Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components | Zohair Mehkri, Anwar Mohammed, David Geiger, Murad Kurwa | 2020-11-03 |
| 10737344 | Method of manufacturing a wave solder pallet | Zohair Mehkri, Anwar Mohammed, David Geiger, Murad Kurwa | 2020-08-11 |