Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7880313 | Semiconductor flip chip package having substantially non-collapsible spacer | Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Robinson Quiazon, Frederick R. Dahilig | 2011-02-01 |
| 7666709 | Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patterns | Yaojian Lin, Rui Huang | 2010-02-23 |
| 7414318 | Etched leadframe flipchip package system | Il Kwon Shim, Sheila Marie L. Alvarez, Robinson Quiazon | 2008-08-19 |
| 7250685 | Etched leadframe flipchip package system | Il Kwon Shim, Sheila Marie L. Alvarez, Robinson Quiazon | 2007-07-31 |