Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8378383 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2013-02-19 |
| 8349735 | Semiconductor device and method of forming conductive TSV with insulating annular ring | Reza A. Pagaila, Byung Tai Do | 2013-01-08 |
| 8263439 | Semiconductor device and method of forming an interposer package with through silicon vias | Pandi C. Marimuthu, Il Kwon Shim, Kock Liang Heng | 2012-09-11 |
| 8125073 | Wafer integrated with permanent carrier and method therefor | Byung Joon Han, Pandi C. Marimuthu, Kock Liang Heng | 2012-02-28 |
| 8093151 | Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang, Dioscoro A. Merilo | 2012-01-10 |
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2011-11-29 |
| 8049328 | Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support | Pandi C. Marimuthu, Kock Liang Heng | 2011-11-01 |
| 8017515 | Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief | Pandi C. Marimuthu, Shuangwu Huang | 2011-09-13 |
| 7880293 | Wafer integrated with permanent carrier and method therefor | Byung Joon Han, Pandi C. Marimuthu, Kock Liang Heng | 2011-02-01 |
| 7863721 | Method and apparatus for wafer level integration using tapered vias | Pandi C. Marimuthu | 2011-01-04 |
| 7838337 | Semiconductor device and method of forming an interposer package with through silicon vias | Pandi C. Marimuthu, Il Kwon Shim, Kock Liang Heng | 2010-11-23 |
| 7741148 | Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support | Pandi C. Marimuthu, Kock Liang Heng | 2010-06-22 |