Issued Patents All Time
Showing 51–75 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8722461 | Leadframe based multi terminal IC package | — | 2014-05-13 |
| 8704381 | Very extremely thin semiconductor package | Somchai Nondhasitthichai | 2014-04-22 |
| 8685794 | Lead frame land grid array with routing connector trace under unit | Somchai Nondhasitthichai, Kasemsan Kongthaworn, Vorajit Suwannaset | 2014-04-01 |
| 8652879 | Lead frame ball grid array with traces under die | Somchai Nondhasitthichai, Kasemsan Kongthaworn, Vorajit Suwannaset | 2014-02-18 |
| 8648474 | Lead frame land grid array | Somchai Nondhasittichai | 2014-02-11 |
| 8575762 | Very extremely thin semiconductor package | Somchai Nondhasitthichai | 2013-11-05 |
| 8575732 | Leadframe based multi terminal IC package | — | 2013-11-05 |
| 8492906 | Lead frame ball grid array with traces under die | Somchai Nondhasitthichai, Kasemsan Kongthaworn, Vorajit Suwannaset | 2013-07-23 |
| 8487451 | Lead frame land grid array with routing connector trace under unit | Somchai Nondhasitthichai, Kasemsan Kongthaworn, Vorajit Suwannaset | 2013-07-16 |
| 8461694 | Lead frame ball grid array with traces under die having interlocking features | — | 2013-06-11 |
| 8460970 | Lead frame ball grid array with traces under die having interlocking features | — | 2013-06-11 |
| 8368189 | Auxiliary leadframe member for stabilizing the bond wire process | — | 2013-02-05 |
| 8338922 | Molded leadframe substrate semiconductor package | Somchai Nondhasitthichai | 2012-12-25 |
| 8310060 | Lead frame land grid array | Somchai Nondhasittichai | 2012-11-13 |
| 8129229 | Method of manufacturing semiconductor package containing flip-chip arrangement | Somchai Nondhasitthichai | 2012-03-06 |
| 8125077 | Package with heat transfer | Somchai Nondhasitthichai | 2012-02-28 |
| 8071426 | Method and apparatus for no lead semiconductor package | Somchai Nondhasitthichai | 2011-12-06 |
| 8063470 | Method and apparatus for no lead semiconductor package | Somchai Nondhasitthichai | 2011-11-22 |
| 8013437 | Package with heat transfer | Somchai Nondhasitthichai | 2011-09-06 |
| 7790512 | Molded leadframe substrate semiconductor package | Somchai Nondhasitthichai | 2010-09-07 |
| 7327017 | Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound | Arlene V. Layson, Somchai Nondhasitthichai, Yee Heong Chua | 2008-02-05 |
| 7205180 | Process of fabricating semiconductor packages using leadframes roughened with chemical etchant | Arlene V. Layson, Somchai Nondhasitthichai, Yee Heong Chua | 2007-04-17 |
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe | Somchai Nondhasitthichai, Sitta Jewjaitham, Yee Heong Chua | 2006-12-26 |
| 7060535 | Flat no-lead semiconductor die package including stud terminals | Somchai Nondhasitthichai, Sitta Jewjaitham | 2006-06-13 |
| 7049683 | Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound | Arlene V. Layson, Somohal Nondhasitthichai, Yee Heong Chua | 2006-05-23 |