Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe | Saravuth Sirinorakul, Somchai Nondhasitthichai, Yee Heong Chua | 2006-12-26 |
| 7060535 | Flat no-lead semiconductor die package including stud terminals | Saravuth Sirinorakul, Somchai Nondhasitthichai | 2006-06-13 |