Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7327017 | Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound | Saravuth Sirinorakul, Arlene V. Layson, Somchai Nondhasitthichai | 2008-02-05 |
| 7205180 | Process of fabricating semiconductor packages using leadframes roughened with chemical etchant | Saravuth Sirinorakul, Arlene V. Layson, Somchai Nondhasitthichai | 2007-04-17 |
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe | Saravuth Sirinorakul, Somchai Nondhasitthichai, Sitta Jewjaitham | 2006-12-26 |
| 7049683 | Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound | Saravuth Sirinorakul, Arlene V. Layson, Somohal Nondhasitthichai | 2006-05-23 |