Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11921318 | Semiconductor structure and method of forming the same | Xiaojun Chen, Honglin ZENG, Dongsheng Zhang, Xiage YIN, Jiaheng WU | 2024-03-05 |
| 10739415 | Printed circuit board and detection method for detecting connection between printed circuit board and flexible circuit board, and display panel | Changjun Zhang, Lingling Liu | 2020-08-11 |
| 10607946 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Jianmin Fang, Kang Chen | 2020-03-31 |
| 10580379 | Display panel and driving method therefor, and display apparatus | Zhiwei Zhang | 2020-03-03 |
| 10428654 | Cutter head for microwave presplitting type hard-rock tunnel boring machine | Gao Ming Lu, Yuan Li, Xi wei Zhang | 2019-10-01 |
| 10365193 | Test apparatus and method for determining time-dependence failure under constant temperature through high pressure true triaxial loading for hard rock | Xi wei Zhang, Cheng Yang, Shuai Peng, Jun Tian, Rui Kong +1 more | 2019-07-30 |
| 10359160 | Light emitting device for a container | — | 2019-07-23 |
| 10324014 | Low-frequency disturbance and high-speed impact type high-pressure true triaxial test apparatus and method | Xi wei Zhang, Rui Kong, Cheng Yang, Dong MA, Shuai Peng +3 more | 2019-06-18 |
| 10304398 | Driver integrated circuit for driving display panel, display device and method for driving driver integrated circuit capable of providing different current intensities to different length transmission wires | Liangliang Zheng, Jian He, Tingting Jin | 2019-05-28 |
| 10204866 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Jianmin Fang | 2019-02-12 |
| 10163815 | Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer | Yaojian Lin, Kang Chen, Jianmin Fang | 2018-12-25 |
| 9754867 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Kang Chen, Jianmin Fang | 2017-09-05 |
| 9679863 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Jianmin Fang, Kang Chen | 2017-06-13 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9626922 | GOA circuit, array substrate, display device and driving method | Jiacheng Huang, Jian He | 2017-04-18 |
| 9558958 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Jianmin Fang | 2017-01-31 |
| 9548240 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Kang Chen, Jianmin Fang | 2017-01-17 |
| 9542898 | Driving method of a liquid crystal display panel, a liquid crystal display panel and a display device | Jiacheng Huang, Donghui Wang | 2017-01-10 |
| 9472452 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang | 2016-10-18 |
| 9437552 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang, Xusheng Bao | 2016-09-06 |
| 9368538 | Image sensor device and method of manufacturing the same | Haifang Zhang, Herb He Huang, Xuan Liu, PingHuan Wu | 2016-06-14 |
| 9269313 | GOA circuit, array substrate, and display device | Jiacheng Huang, Jian He | 2016-02-23 |
| 9202713 | Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch | Yaojian Lin, Kang Chen, Jianmin Fang | 2015-12-01 |
| 9087930 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2015-07-21 |
| 8962476 | Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis | Yaojian Lin, Jianmin Feng, Kang Chen | 2015-02-24 |