Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8907476 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Jianmin Fang | 2014-12-09 |
| 8878359 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang, Xusheng Bao | 2014-11-04 |
| 8786100 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang | 2014-07-22 |
| 8759155 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2014-06-24 |
| 8642446 | Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer | Yaojian Lin, Kang Chen, Jianmin Fang | 2014-02-04 |
| 8501618 | Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis | Yaojian Lin, Jianmin Fang, Kang Chen | 2013-08-06 |
| 8456002 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2013-06-04 |
| 8409926 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang, Xusheng Bao | 2013-04-02 |
| 8343809 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang | 2013-01-01 |
| 8183095 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Jianmin Fang | 2012-05-22 |