Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075117 | Die singulation and stacked device structures | Ganesh Hariharan, Inderjit Singh | 2021-07-27 |
| 10840192 | Stacked silicon package assembly having enhanced stiffener | Nael Zohni, Shin S. Low, Inderjit Singh, Ganesh Hariharan | 2020-11-17 |
| 10638608 | Interconnect frames for SIP modules | Lan H. Hoang, Chang Liu, Takayoshi Katahira | 2020-04-28 |
| 10602612 | Vertical module and perpendicular pin array interconnect for stacked circuit board structure | Lan H. Hoang, Takayoshi Katahira, Leilei Zhang | 2020-03-24 |
| 10204841 | Temporary connection traces for wafer sort testing | Matthew H. Klein | 2019-02-12 |
| 10032682 | Multi-die wafer-level test and assembly without comprehensive individual die singulation | Matthew H. Klein, Glenn O'Rourke | 2018-07-24 |
| 9989572 | Method and apparatus for testing interposer dies prior to assembly | Ganesh Hariharan, Amitava Majumdar | 2018-06-05 |
| 9865567 | Heterogeneous integration of integrated circuit device and companion device | Ganesh Hariharan, Inderjit Singh, Amitava Majumdar, Glenn O'Rourke | 2018-01-09 |
| 9761533 | Interposer-less stack die interconnect | Amitava Majumdar, Glenn O'Rourke, Inderjit Singh | 2017-09-12 |
| 9418909 | Stacked silicon package assembly having enhanced lid adhesion | Inderjit Singh | 2016-08-16 |
| 9385106 | Method for providing charge protection to one or more dies during formation of a stacked silicon device | Inderjit Singh, Glenn O'Rourke, Ganesh Hariharan | 2016-07-05 |
| 9341668 | Integrated circuit package testing | Ganesh Hariharan, Glenn O'Rourke, Inderjit Singh, Eric J. Thorne, David E. Schweigler | 2016-05-17 |
| 8900987 | Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices | Inderjit Singh, Ganesh Hariharan, Glenn O'Rourke | 2014-12-02 |
| 8841752 | Semiconductor structure and method for interconnection of integrated circuits | Kumar Nagarajan | 2014-09-23 |
| 8766086 | System and method for laminating photovoltaic structures | Abhay Maheshwari | 2014-07-01 |
| 8704384 | Stacked die assembly | Ephrem C. Wu | 2014-04-22 |
| 8519528 | Semiconductor structure and method for interconnection of integrated circuits | Kumar Nagarajan | 2013-08-27 |
| 8415783 | Apparatus and methodology for testing stacked die | Arifur Rahman | 2013-04-09 |
| 8361259 | System and method for determining placement of photovoltaic strips using displacement sensors | Shirish Shah, Frank Magana, Junaid Fatehi, Enrico Casaje | 2013-01-29 |
| 7906857 | Molded integrated circuit package and method of forming a molded integrated circuit package | Lan H. Hoang, Laurene Yip | 2011-03-15 |
| 7863092 | Low cost bumping and bonding method for stacked die | Arifur Rahman | 2011-01-04 |
| 7338842 | Process for exposing solder bumps on an underfill coated semiconductor | Christopher Dominic | 2008-03-04 |