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Die singulation and stacked device structures |
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Stacked silicon package assembly having enhanced stiffener |
Nael Zohni, Shin S. Low, Inderjit Singh, Ganesh Hariharan |
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Interconnect frames for SIP modules |
Lan H. Hoang, Chang Liu, Takayoshi Katahira |
2020-04-28 |
| 10602612 |
Vertical module and perpendicular pin array interconnect for stacked circuit board structure |
Lan H. Hoang, Takayoshi Katahira, Leilei Zhang |
2020-03-24 |
| 10204841 |
Temporary connection traces for wafer sort testing |
Matthew H. Klein |
2019-02-12 |
| 10032682 |
Multi-die wafer-level test and assembly without comprehensive individual die singulation |
Matthew H. Klein, Glenn O'Rourke |
2018-07-24 |
| 9989572 |
Method and apparatus for testing interposer dies prior to assembly |
Ganesh Hariharan, Amitava Majumdar |
2018-06-05 |
| 9865567 |
Heterogeneous integration of integrated circuit device and companion device |
Ganesh Hariharan, Inderjit Singh, Amitava Majumdar, Glenn O'Rourke |
2018-01-09 |
| 9761533 |
Interposer-less stack die interconnect |
Amitava Majumdar, Glenn O'Rourke, Inderjit Singh |
2017-09-12 |
| 9418909 |
Stacked silicon package assembly having enhanced lid adhesion |
Inderjit Singh |
2016-08-16 |
| 9385106 |
Method for providing charge protection to one or more dies during formation of a stacked silicon device |
Inderjit Singh, Glenn O'Rourke, Ganesh Hariharan |
2016-07-05 |
| 9341668 |
Integrated circuit package testing |
Ganesh Hariharan, Glenn O'Rourke, Inderjit Singh, Eric J. Thorne, David E. Schweigler |
2016-05-17 |
| 8900987 |
Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices |
Inderjit Singh, Ganesh Hariharan, Glenn O'Rourke |
2014-12-02 |
| 8841752 |
Semiconductor structure and method for interconnection of integrated circuits |
Kumar Nagarajan |
2014-09-23 |
| 8766086 |
System and method for laminating photovoltaic structures |
Abhay Maheshwari |
2014-07-01 |
| 8704384 |
Stacked die assembly |
Ephrem C. Wu |
2014-04-22 |
| 8519528 |
Semiconductor structure and method for interconnection of integrated circuits |
Kumar Nagarajan |
2013-08-27 |
| 8415783 |
Apparatus and methodology for testing stacked die |
Arifur Rahman |
2013-04-09 |
| 8361259 |
System and method for determining placement of photovoltaic strips using displacement sensors |
Shirish Shah, Frank Magana, Junaid Fatehi, Enrico Casaje |
2013-01-29 |
| 7906857 |
Molded integrated circuit package and method of forming a molded integrated circuit package |
Lan H. Hoang, Laurene Yip |
2011-03-15 |
| 7863092 |
Low cost bumping and bonding method for stacked die |
Arifur Rahman |
2011-01-04 |
| 7338842 |
Process for exposing solder bumps on an underfill coated semiconductor |
Christopher Dominic |
2008-03-04 |
