| 11075117 |
Die singulation and stacked device structures |
Raghunandan Chaware, Inderjit Singh |
2021-07-27 |
| 10840192 |
Stacked silicon package assembly having enhanced stiffener |
Nael Zohni, Shin S. Low, Inderjit Singh, Raghunandan Chaware |
2020-11-17 |
| 9989572 |
Method and apparatus for testing interposer dies prior to assembly |
Raghunandan Chaware, Amitava Majumdar |
2018-06-05 |
| 9865567 |
Heterogeneous integration of integrated circuit device and companion device |
Raghunandan Chaware, Inderjit Singh, Amitava Majumdar, Glenn O'Rourke |
2018-01-09 |
| 9385106 |
Method for providing charge protection to one or more dies during formation of a stacked silicon device |
Raghunandan Chaware, Inderjit Singh, Glenn O'Rourke |
2016-07-05 |
| 9341668 |
Integrated circuit package testing |
Raghunandan Chaware, Glenn O'Rourke, Inderjit Singh, Eric J. Thorne, David E. Schweigler |
2016-05-17 |
| 8900987 |
Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices |
Inderjit Singh, Raghunandan Chaware, Glenn O'Rourke |
2014-12-02 |