Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7338842 | Process for exposing solder bumps on an underfill coated semiconductor | Raghunandan Chaware | 2008-03-04 |
| 6805187 | Security cover | Scott Padiak, Thomas M. Conway | 2004-10-19 |
| 6775936 | Movable display sign | Scott Padiak, Thomas M. Conway, Paul C. Evans | 2004-08-17 |
| 6620651 | Adhesive wafers for die attach application | Xiping He | 2003-09-16 |
| 5972735 | Method of preparing an electronic package by co-curing adhesive and encapsulant | — | 1999-10-26 |