Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8410604 | Lead-free structures in a semiconductor device | Leilei Zhang, Kumar Nagarajan | 2013-04-02 | $5,127,000 |
| 7906857 | Molded integrated circuit package and method of forming a molded integrated circuit package | Lan H. Hoang, Raghunandan Chaware | 2011-03-15 | $21,663,000 |