Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12153268 | Technologies for increased volumetric and functional efficiencies of optical packages | Scott D. Morrison, Kishore N. Renjan, Kyusang Kim, Lan H. Hoang, Manoj Vadeentavida | 2024-11-26 |
| 12148741 | Sidewall connections and button interconnects for molded SiPs | Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena +2 more | 2024-11-19 |
| 12095185 | Built-in connector for board-to-board and flex-to-rigid board connection | Lan H. Hoang, Takayoshi Katahira, Kishore N. Renjan, Manoj Vadeentavida, Jing Tao | 2024-09-17 |
| 11817383 | Packaging technologies for temperature sensing in health care products | Pierpaolo Lupo, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida | 2023-11-14 |
| 11765838 | Right angle sidewall and button interconnects for molded SiPs | Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena +2 more | 2023-09-19 |
| 11651976 | Embedded packaging concepts for integration of ASICs and optical components | Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Prashanth S. Holenarsipur +3 more | 2023-05-16 |
| 11552053 | Miniaturization of optical sensor modules through wirebonded ball stacks | Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Praveesh Chandran | 2023-01-10 |
| 11313741 | Packaging technologies for temperature sensing in health care products | Pierpaolo Lupo, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida | 2022-04-26 |