Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7696006 | Composite flip-chip package with encased components and method of fabricating same | Paul Ying-Fung Wu | 2010-04-13 |
| 7378733 | Composite flip-chip package with encased components and method of fabricating same | Paul Ying-Fung Wu | 2008-05-27 |
| 7361995 | Molded high density electronic packaging structure for high performance applications | Kim-Yong Goh, Rahul Kapoor, Anthony Yi Sheng Sun, Desmond Yok Rue Chong | 2008-04-22 |
| 7098542 | Multi-chip configuration to connect flip-chips to flip-chips | Paul Ying-Fung Wu | 2006-08-29 |
| 7061102 | High performance flipchip package that incorporates heat removal with minimal thermal mismatch | Abu K. Eghan | 2006-06-13 |
| 6744131 | Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity | Hoa Do, Leilei Zhang | 2004-06-01 |
| 6475828 | Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chip | — | 2002-11-05 |
| 6373142 | Method of adding filler into a non-filled underfill system by using a highly filled fillet | — | 2002-04-16 |
| 6201301 | Low cost thermally enhanced flip chip BGA | — | 2001-03-13 |
| 5942795 | Leaded substrate carrier for integrated circuit device and leaded substrate carrier device assembly | — | 1999-08-24 |