Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7701070 | Integrated circuit and method of implementing a contact pad in an integrated circuit | Richard C. Li, Qi Lin | 2010-04-20 |
| 7064450 | Semiconductor die with high density offset-inline bond arrangement | Richard C. Li, Xin Wu | 2006-06-20 |
| 7061102 | High performance flipchip package that incorporates heat removal with minimal thermal mismatch | Lan H. Hoang | 2006-06-13 |