| 12453050 |
Heat pipe including an integrated antenna |
Vivek Sahu, Brian Toleno |
2025-10-21 |
|
| 12393052 |
Systems and methods for controlling thermal energy between hinged portions of electronic devices |
Brian Toleno, Igor Markovsky, Hunter Cantrell, Shobhit Verma |
2025-08-19 |
|
| 12328845 |
Thermal conduit for electronic device |
Brian Toleno |
2025-06-10 |
|
| 12317408 |
Stack-PCB architecture with embedded vapor chamber |
Brian Toleno, Patrick Codd |
2025-05-27 |
|
| 12108576 |
Thermal interposer for electronic device |
Brian Toleno |
2024-10-01 |
$919,225,000 |
| 12032171 |
Thermal hinge system |
Hunter Cantrell, Brian Toleno, Shobhit Verma, Igor Markovsky |
2024-07-09 |
$593,948,000 |
| 11991870 |
Thermal interface material for electronic device |
Brian Toleno |
2024-05-21 |
$983,654,000 |
| 11839054 |
Stack-PCB design and midplane architecture |
Brian Toleno, Patrick Codd |
2023-12-05 |
$520,018,000 |
| 11796258 |
Sealing a heat pipe |
Tzu-Yuan Lin, Erin Hurbi, Dong Woo Kim |
2023-10-24 |
$295,109,000 |
| 11397055 |
Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid |
Shahar Ben-Menahem, Tzu-Yuan Lin |
2022-07-26 |
$385,350,000 |
| 11304334 |
Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same |
Brian Toleno, Erin Hurbi, Tzu-Yuan Lin |
2022-04-12 |
$182,277,000 |
| 11150694 |
Fit system using collapsible beams for wearable articles |
Igor Markovsky, Tzu-Yuan Lin, Vijay Boovaragavan, Brian Toleno |
2021-10-19 |
$230,268,000 |
| 11125513 |
Formable interface and shielding structures |
Renee Wu |
2021-09-21 |
$157,007,000 |
| 10989919 |
Support assembly pad shape for providing universal fitting head-mounted display devices |
Igor Markovsky, Shahar Ben-Menahem, Tzu-Yuan Lin |
2021-04-27 |
$199,175,000 |
| 10962298 |
Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
Shahar Ben-Menahem, Tzu-Yuan Lin |
2021-03-30 |
$145,552,000 |
| 10935325 |
Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid |
Shahar Ben-Menahem, Tzu-Yuan Lin |
2021-03-02 |
$181,927,000 |
| 10782534 |
Near eye display (NED) device housing shell integrated with molded boss clusters for precision mounting of hardware components |
Brian Toleno, Michael Beerman, Marianne E. Laford, Igor Markovsky, Simon Hodgson |
2020-09-22 |
$181,018,000 |
| 10763535 |
Variable layer thickness in curved battery cell |
Vijayasekaran Booveragavan, Dongli Zeng, Tzu-Yuan Lin, John Christopher Collins |
2020-09-01 |
$133,035,000 |
| 10623722 |
Head-up multiplex display with redirection optic |
Igor Markovsky |
2020-04-14 |
$125,652,000 |
| 10616999 |
Audible signal attenuating printed circuit board |
Brian Toleno, Marianne Elizabeth La Ford, Igor Markovsky |
2020-04-07 |
$77,706,000 |
| 10606083 |
Perspiration dissipating support assembly for head-mounted display devices |
Tzu-Yuan Lin, Brian Toleno, Igor Markovsky, Erin Hurbi |
2020-03-31 |
$74,701,000 |
| 10527355 |
Devices, methods, and systems for thermal management |
Erin Hurbi |
2020-01-07 |
$59,890,000 |
| 10505232 |
Stacked, rolled-electrode battery cell with y-axis bending |
Dongli Zeng, Vijayasekaran Boovaragavan, John Christopher Collins, Tzu-Yuan Lin |
2019-12-10 |
|
| 10444515 |
Convective optical mount structure |
Erin Hurbi |
2019-10-15 |
$42,745,000 |
| 10433467 |
Thermal dissipation system for wearable electronic devices |
Erin Hurbi |
2019-10-01 |
$68,983,000 |