Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12393052 | Systems and methods for controlling thermal energy between hinged portions of electronic devices | Michael Nikkhoo, Igor Markovsky, Hunter Cantrell, Shobhit Verma | 2025-08-19 |
| 12328845 | Thermal conduit for electronic device | Michael Nikkhoo | 2025-06-10 |
| 12317408 | Stack-PCB architecture with embedded vapor chamber | Michael Nikkhoo, Patrick Codd | 2025-05-27 |
| 12108576 | Thermal interposer for electronic device | Michael Nikkhoo | 2024-10-01 |
| 12032171 | Thermal hinge system | Michael Nikkhoo, Hunter Cantrell, Shobhit Verma, Igor Markovsky | 2024-07-09 |
| 11991870 | Thermal interface material for electronic device | Michael Nikkhoo | 2024-05-21 |
| 11839054 | Stack-PCB design and midplane architecture | Michael Nikkhoo, Patrick Codd | 2023-12-05 |
| 11686947 | Structural fiber component for injection molding in head mounted displays | Bryan Richard LOYOLA | 2023-06-27 |
| 11304334 | Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same | Erin Hurbi, Michael Nikkhoo, Tzu-Yuan Lin | 2022-04-12 |
| 11201103 | Vapor chamber on heat-generating component | Lincoln Matthew Ghioni, Sahar Vilan, HAN-YU LI, Bo Dan | 2021-12-14 |
| 11150694 | Fit system using collapsible beams for wearable articles | Igor Markovsky, Tzu-Yuan Lin, Vijay Boovaragavan, Michael Nikkhoo | 2021-10-19 |
| 10888037 | Anti-fogging HMD utilizing device waste heat | Gavin D. Stanley, Douglas L. Heirich, Tzu-Yuan Lin, Sridhar Canumalla | 2021-01-05 |
| 10854175 | Monitoring support element strain to determine real-time positional relationships between positionally sensitive device components | William Steven ZURBRICK, Marianne E. Laford | 2020-12-01 |
| 10806053 | Thermally conductive textiles for heat dissipation from wearable electronic devices | Gavin D. Stanley, Douglas L. Heirich, Tzu-Yuan Lin, Sridhar Canumalla | 2020-10-13 |
| 10782534 | Near eye display (NED) device housing shell integrated with molded boss clusters for precision mounting of hardware components | Michael Nikkhoo, Michael Beerman, Marianne E. Laford, Igor Markovsky, Simon Hodgson | 2020-09-22 |
| 10736244 | Wearable electronic devices having multiple layers of electromagnetic spectrum specific paint for enhanced thermal performance | Tzu-Yuan Lin, Douglas L. Heirich, Gavin D. Stanley, Sridhar Canumalla, Sravan Kuman Reddy Gondipalli | 2020-08-04 |
| 10616999 | Audible signal attenuating printed circuit board | Marianne Elizabeth La Ford, Michael Nikkhoo, Igor Markovsky | 2020-04-07 |
| 10606083 | Perspiration dissipating support assembly for head-mounted display devices | Tzu-Yuan Lin, Igor Markovsky, Erin Hurbi, Michael Nikkhoo | 2020-03-31 |
| 10375845 | Devices with mounted components | Erin Hurbi, Michael Nikkhoo, Igor Markovsky | 2019-08-06 |
| 10080317 | Polymeric electromagnetic shield for electronic components | Igor Markovsky | 2018-09-18 |