Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810863 | Sensor | Chi-Fu Wu, Hao Wu, Ming-Hung Wu, Chun-Yang Tai, Tsutomu Fukai | 2023-11-07 |
| 10903136 | Package structure having a plurality of insulating layers | Ming-Hung Wu, Chi-Fu Wu, Hao Wu | 2021-01-26 |
| 10811332 | Thermal-dissipating substrate structure | Ming-Hung Wu, Chi-Fu Wu, Hao Wu | 2020-10-20 |
| 9439292 | Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure | Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yung-Lin Chia | 2016-09-06 |
| 9301405 | Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole | Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yu-Te Lu, Yung-Lin Chia | 2016-03-29 |
| 5868093 | Amphibious vehicle | — | 1999-02-09 |
| 5626197 | Road scraper having vertically and horizontally displaceable auxiliary scraping device | — | 1997-05-06 |