Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756040 | Semiconductor package with rigid under bump metallurgy (UBM) stack | Ta-Jen Yu, Chi-Yuan Chen | 2020-08-25 |
| 10580747 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Ta-Jen Yu, Andrew C. Chang | 2020-03-03 |
| 10573616 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Ta-Jen Yu, Andrew C. Chang | 2020-02-25 |
| 10573536 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2020-02-25 |
| 10573579 | Semiconductor package with improved heat dissipation | Tai-Yu Chen, Sheng-Liang Kuo, Chi-Wen Pan, Jen-Chuan Chen | 2020-02-25 |
| 10573615 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Ta-Jen Yu, Andrew C. Chang | 2020-02-25 |
| 10553526 | Semiconductor package | Tzu-Hung Lin, Ta-Jen Yu | 2020-02-04 |
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Shih-Yi Syu, Chia-Yu Jin, Che-Ya Chou, Nan-Cheng Chen | 2019-12-24 |
| 10354974 | Structure and formation method of chip package structure | Shih-Chin Lin, Andrew C. Chang, Tao Cheng | 2019-07-16 |
| 10340198 | Semiconductor package with embedded supporter and method for fabricating the same | Ta-Jen Yu | 2019-07-02 |
| 10340199 | Packaging substrate with block-type via and semiconductor packages having the same | Tai-Yu Chen | 2019-07-02 |
| 10312222 | Semiconductor package and semiconductor device using the same | Shih-Chin Lin, Tao Cheng | 2019-06-04 |
| 10242927 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Shih-Chin Lin, Ming-Jen Hsiung | 2019-03-26 |
| 10236187 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2019-03-19 |
| 10236242 | Chip package and package substrate | Ta-Jen Yu | 2019-03-19 |
| 10217716 | Semiconductor package and method for fabricating the same | Ta-Jen Yu, Yu-Sheng Hung | 2019-02-26 |
| 10186488 | Manufacturing method of semiconductor package and manufacturing method of semiconductor device | Shih-Chin Lin, Tao Cheng, Andrew C. Chang | 2019-01-22 |
| 10115604 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2018-10-30 |
| 10109608 | Semiconductor package | Tzu-Hung Lin, Tai-Yu Chen | 2018-10-23 |
| 10074581 | Chip package having a patterned conducting plate and a conducting pad with a recess | Ming-Chieh Lin, Ta-Jen Yu | 2018-09-11 |
| 9922844 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2018-03-20 |
| 9908203 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Tao Cheng, Shih-Chin Lin | 2018-03-06 |
| 9881902 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Shih-Chin Lin, Tao Cheng | 2018-01-30 |
| 9852973 | Manufacturing method of chip package and package substrate | Ta-Jen Yu | 2017-12-26 |
| 9761534 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Shih-Chin Lin, Tao Cheng, Andrew C. Chang | 2017-09-12 |